Individual Maximum-Amount Guarantee ContractReneSola LTD • June 10th, 2009 • Semiconductors & related devices
Whereas Party B has granted the credit lines for the first, third and fifth item listed below to Sichuan ReneSola Silicon Material Co., Ltd (hereinafter referred to as the “Debtor”) and during the period from January 24th 2009 to January 23rd 2014 (the “Debt Forming Period”) has signed and/or will sign RMB Loan Contract, Foreign Exchange Loan Contract, Bank Acceptance Agreement, Issuing Letters of Credit Contract, Opening Guarantee Agreement, Trade Financing Credit Lines Contracts and/or other legal documents with the Debtor (the above-mentioned contracts, agreements and/or other legal documents signed during the Debt Forming Period hereinafter referred to as the “Main Contracts”):
REPUBBLICA ITALIANAAvago Technologies ECBU IP (Singapore) Pte. Ltd. • November 15th, 2006 • Semiconductors & related devices
L’anno 2005 duemilacinque, il giorno 4 quattro del mese di ottobre. In Milano, nel mio studio sito in Via Vittor Pisani n. 9. Avanti a me Dott. Pasquale Lebano, Notaio in Milano, iscritto al Collegio Notarile del Distretto di Milano