（General Agreement for Omnibus Credit Lines）Applied Optoelectronics, Inc. • December 17th, 2018 • Semiconductors & related devices
The undersigned （the “Customer”）, hereby applies for an omnibus credit line with CTBC Bank Co., Ltd. （including its head office and branches, hereinafter referred to as the “Bank”） and agrees to the terms and conditions of this General Agreement for Omnibus Credit Lines （this “Agreement”） with the following total omnibus credit line （exclusive of the credit lines extended under and pursuant to any and all syndicated loans）:
CERTIFICATE FOR PROVISION OF COLLATERAL AND PLEDGE AGREEMENTApplied Optoelectronics, Inc. • February 25th, 2016 • Semiconductors & related devices
In order to secure all indebtedness to CTBC Bank Co., Ltd. (for the purpose of this Agreement, including the head office, domestic branches and overseas branches, hereinafter the “Bank”) under Article 1 below whether presently (including debts incurred in the past and currently not yet repaid) or in the future, owed by the Customer himself or third party, Applied Optoelectronics, Inc., Taiwan Branch (the “Borrower”), to the extent under the maximum pledge in an amount of NTD (or its equivalent amount in foreign currency) One Hundred and Twenty Million Dollars Only, the undersigned (the “Customer”) hereby provides the collateral or the beneficiary right to the trust asset as listed in attached collateral list to the Bank, and agrees to comply with the following terms and conditions: