Application for Listing. The Issuer confirms that it has made or caused to be made an application for the Subscription Securities to be listed on the Singapore Stock Exchange and that it will, in accordance with the terms of this Agreement, make or cause to be made an application for the Shares to be issued on conversion of the Subscription Securities (the “New Shares”) to be listed on The Stock Exchange of Hong Kong Limited (the “Hong Kong Stock Exchange”).
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Samples: Subscription Agreement (Semiconductor Manufacturing International Corp), Subscription Agreement (Semiconductor Manufacturing International Corp), Agreement (Xinxin (Hong Kong) Capital Co., LTD)
Application for Listing. The Issuer confirms that it has made or caused cause to be made an application for the Subscription Securities Bonds to be listed on the Singapore Stock Exchange and that it will, in accordance with the terms of this Agreement, make or cause to be made an application for the Shares to be issued on conversion of the Subscription Securities Bonds (the “New Shares”) to be listed on The Stock Exchange of Hong Kong Limited (the “Hong Kong Stock Exchange”).
Appears in 2 contracts
Samples: Subscription Agreement, Subscription Agreement (Datang Telecom Technology & Industry Holdings LTD)
Application for Listing. The Issuer confirms that it has made or caused cause to be made an application for the Subscription Securities Bonds to be listed on the Singapore Stock Exchange and that it will, in accordance with the terms of this Agreement, make or cause to be made an application for the Shares to be issued on conversion of the Subscription Securities Bonds (the “New Shares”) to be listed on The Stock Exchange of Hong Kong Limited (the “Hong Kong Stock Exchange”).
Appears in 2 contracts
Samples: Subscription Agreement (Semiconductor Manufacturing International Corp), Subscription Agreement (Semiconductor Manufacturing International Corp)
Application for Listing. The Issuer confirms that it has made or caused to be made an application for the Subscription Securities Bonds to be listed on the Singapore Stock Exchange and that it will, in accordance with the terms of this Agreement, make or cause to be made an application for the Shares to be issued on conversion of the Subscription Securities Bonds (the “New Shares”) to be listed on The Stock Exchange of Hong Kong Limited (the “Hong Kong Stock Exchange”).
Appears in 1 contract
Samples: Subscription Agreement (Datang Telecom Technology & Industry Holdings LTD)
Application for Listing. The Issuer confirms that it has made or caused will cause to be made an application for the Subscription Securities Bonds to be listed on the Singapore Stock Exchange and that it will, in accordance with the terms of this Agreement, make or cause to be made an application for the Shares to be issued on conversion of the Subscription Securities Bonds (the “New Shares”) to be listed on The Stock Exchange of Hong Kong Limited (the “Hong Kong Stock Exchange”).
Appears in 1 contract
