Bonding and Grounding Specifications. The System and all associated electrical components shall be grounded and bonded to current EIA and IEEE specifications.
Appears in 3 contracts
Samples: Escrow Agreement (Pathnet Inc), Pledge Agreement (Pathnet Inc), Fixed Point Microwave Services Agreement (Pathnet Inc)
Bonding and Grounding Specifications. The System and all associated electrical components shall be grounded and bonded to current EIA and IEEE specifications.specifications and in accordance with the Specifications set forth on Exhibit A-6 to this Schedule A.
Appears in 3 contracts
Samples: Escrow Agreement (Pathnet Inc), Security Agreement (Pathnet Inc), Escrow Agreement (Pathnet Inc)
