We use cookies on our site to analyze traffic, enhance your experience, and provide you with tailored content.

For more information visit our privacy policy.

Tvia Inc Sample Contracts

Standard Contracts

EXHIBIT 4.2 TVIA, INC.
Registration Rights Agreement • April 4th, 2000 • Tvia Inc • California
WARRANT
Warrant Agreement • July 28th, 2000 • Tvia Inc • Semiconductors & related devices • California
Tvia, Inc. Common Stock
Underwriting Agreement • July 14th, 2000 • Tvia Inc • Semiconductors & related devices • New York
CONSULTING ---------- CONFIDENTIALITY AGREEMENT -------------------------
Confidentiality Agreement • June 29th, 2001 • Tvia Inc • Semiconductors & related devices • California
ADDENDUM TO TECHNOLOGY LICENSE AGREEMENT BETWEEN OAK TECHNOLOGY, INC. AND TVIA, INC.
Technology License Agreement • June 28th, 2002 • Tvia Inc • Semiconductors & related devices
TVIA, INC. STOCK OPTION AGREEMENT (Standard Agreement)
Stock Option Agreement • March 22nd, 2005 • Tvia Inc • Semiconductors & related devices • California

Tvia, Inc. has granted to the individual (the “Optionee”) named in the Notice of Grant of Stock Option (the “Notice”) to which this Stock Option Agreement (the “Option Agreement”) is attached an option (the “Option”) to purchase certain shares of Stock upon the terms and conditions set forth in the Notice and this Option Agreement. The Option has been granted pursuant to and shall in all respects be subject to the terms and conditions of the Tvia, Inc. Amended and Restated 2000 Stock Incentive Plan (the “Plan”), as amended to the Date of Option Grant, the provisions of which are incorporated herein by reference. By signing the Notice, the Optionee: (a) represents that the Optionee has read and is familiar with the terms and conditions of the Notice, the Plan and this Option Agreement, including the Effect of Termination of Service set forth in Section 7, (b) accepts the Option subject to all of the terms and conditions of the Notice, the Plan and this Option Agreement, (c) agrees to ac

SECURITIES PURCHASE AGREEMENT
Securities Purchase Agreement • August 17th, 2006 • Tvia Inc • Semiconductors & related devices • New York

This Securities Purchase Agreement (this “Agreement”) is dated as of August 15, 2006, among Tvia, Inc., a Delaware corporation (the “Company”), and the investors identified on the signature pages hereto (each, an “Investor” and collectively, the “Investors”).

Contract
Securities Agreement • August 17th, 2006 • Tvia Inc • Semiconductors & related devices

NEITHER THESE SECURITIES NOR THE SECURITIES ISSUABLE UPON EXERCISE OF THESE SECURITIES HAVE BEEN REGISTERED WITH THE SECURITIES AND EXCHANGE COMMISSION OR THE SECURITIES COMMISSION OF ANY STATE IN RELIANCE UPON AN EXEMPTION FROM REGISTRATION UNDER THE SECURITIES ACT OF 1933, AS AMENDED (THE “SECURITIES ACT”), AND, ACCORDINGLY, MAY NOT BE OFFERED OR SOLD EXCEPT PURSUANT TO AN EFFECTIVE REGISTRATION STATEMENT UNDER THE SECURITIES ACT OR PURSUANT TO AN AVAILABLE EXEMPTION FROM, OR IN A TRANSACTION NOT SUBJECT TO, THE REGISTRATION REQUIREMENTS OF THE SECURITIES ACT AND IN ACCORDANCE WITH APPLICABLE STATE SECURITIES LAWS AS EVIDENCED BY A LEGAL OPINION OF COUNSEL TO THE TRANSFEROR TO SUCH EFFECT, THE SUBSTANCE OF WHICH SHALL BE REASONABLY ACCEPTABLE TO THE COMPANY. THESE SECURITIES AND THE SECURITIES ISSUABLE UPON EXERCISE OF THESE SECURITIES MAY BE PLEDGED IN CONNECTION WITH A BONA FIDE MARGIN ACCOUNT SECURED BY SUCH SECURITIES.

REGISTRATION RIGHTS AGREEMENT
Registration Rights Agreement • August 17th, 2006 • Tvia Inc • Semiconductors & related devices • New York

This Registration Rights Agreement (this “Agreement”) is made and entered into as of August 15, 2006, by and among Tvia, Inc., a Delaware corporation (the “Company”), and the investors signatory hereto (each a “Investor” and collectively, the “Investors”).

TVIA, INC. STOCK OPTION AGREEMENT (Single Trigger Acceleration Agreement)
Stock Option Agreement • March 22nd, 2005 • Tvia Inc • Semiconductors & related devices • California

Tvia, Inc. has granted to the individual (the “Optionee”) named in the Notice of Grant of Stock Option (the “Notice”) to which this Stock Option Agreement (the “Option Agreement”) is attached an option (the “Option”) to purchase certain shares of Stock upon the terms and conditions set forth in the Notice and this Option Agreement. The Option has been granted pursuant to and shall in all respects be subject to the terms and conditions of the Tvia, Inc. Amended and Restated 2000 Stock Incentive Plan (the “Plan”), as amended to the Date of Option Grant, the provisions of which are incorporated herein by reference. By signing the Notice, the Optionee: (a) represents that the Optionee has read and is familiar with the terms and conditions of the Notice, the Plan and this Option Agreement, including the Effect of Termination of Service set forth in Section 7, (b) accepts the Option subject to all of the terms and conditions of the Notice, the Plan and this Option Agreement, (c) agrees to ac

AGREEMENT FOR THE PURCHASE AND SALE OF ASSETS by and between MEDIATEK, INC., MEDIATEK LIMITED CRYSTALMEDIA TECHNOLOGY, INC. (collectively, as “MediaTek”) and
Purchase and Sale Agreement • July 17th, 2003 • Tvia Inc • Semiconductors & related devices • California

THIS AGREEMENT FOR THE PURCHASE AND SALE OF ASSETS (“Agreement”) is made as of June 17, 2003 by and between Tvia, Inc., a Delaware corporation, having its principal office at 4001 Burton Drive, Santa Clara, CA 95054 (“Tvia Inc.”) and 英圖微電子(合肥)有限公司, a foreign wholly owned enterprise established in accordance with the relevant laws of the People’s Republic of China, having a principal office at Hefei New and High Technology Industry Development Zone, 669 ChangJiang Road West, Hefei, Anhui, P.R. China 230088 (“Tvia China”) (as used in this Agreement, “Tvia” may refer to Tvia Inc. and Tvia China collectively or to either such entity as the context may require), on the one hand, and MediaTek, Inc., a corporation organized and existing under the laws of the Republic of China, having a principal office at 5F, No. 1-2 Innovation Road 1, Science-Based Industrial Park, Hsin-Chu, Taiwan 300 (“MediaTek Inc.”), MediaTek Limited, a corporation organized and existing under the laws of Western Samoa,

Contract
Lease Agreement • June 17th, 2005 • Tvia Inc • Semiconductors & related devices

THIS FIFTH AMENDMENT TO LEASE (this “Amendment”) is made and entered into this 17th day of May, 2005, by and between KOLL/INTEREAL BAY AREA, a California general partnership (“Landlord”), and TVIA, INC., a Delaware corporation (“Tenant”).

UNITED STATES BANKRUPTCY COURT NORTHERN DISTRICT OF CALIFORNIA SAN JOSE DIVISION
Legal Representation Agreement • December 21st, 2009 • Tvia Inc • Semiconductors & related devices • California

The official committee of equity security holders of Tvia, Inc. (the “Committee”) proposes the following plan under chapter 11 of title 11 of the United States Code.

UNITED STATES BANKRUPTCY COURT NORTHERN DISTRICT OF CALIFORNIA SAN JOSE DIVISION
Official Committee of Equity Security Holders Representation Agreement • October 21st, 2009 • Tvia Inc • Semiconductors & related devices • California
AMENDMENT TO AGREEMENT FOR THE PURCHASE AND SALE OF ASSETS
Agreement for the Purchase and Sale of Assets • July 17th, 2003 • Tvia Inc • Semiconductors & related devices

This Amendment (this “Amendment”) is entered into as of July 3, 2003 to the Agreement for the Purchase and Sale of Assets, dated as of June 17, 2003, by and between Tvia, Inc., a Delaware corporation (“Tvia Inc.”) and 英圖微電子(合肥)有限公司, a wholly foreign owned enterprise established in accordance with the relevant laws and regulations of the People’s Republic of China (“Tvia China”) (as used in this Amendment, “Tvia” may refer to Tvia Inc. and Tvia China collectively or to either such entity, as the context may require), on the one hand, and MediaTek, Inc., a corporation organized and existing under the laws of the Republic of China (“MediaTek Inc.”), MediaTek Limited, a corporation organized and existing under the laws of Western Samoa and a wholly owned subsidiary of MediaTek Inc. (“MediaTek China”), and CrystalMedia Technology, Inc., a California corporation and a wholly owned subsidiary of MediaTek Inc. (“MediaTek USA”) (as used in this Amendment, “MediaTek” may refer to MediaTek Inc.,

Contract
Lease Agreement • June 17th, 2005 • Tvia Inc • Semiconductors & related devices

THIS FOURTH AMENDMENT TO LEASE (this “Amendment”) is made and entered into this 7th day of June, 2004, by and between KOLL/INTEREAL BAY AREA, a California general partnership (“Landlord”), and TVIA, Inc., a Delaware corporation fka IGS Technologies, Inc., a California corporation (“Tenant”).

Contract
Legal Representation Agreement • December 21st, 2009 • Tvia Inc • Semiconductors & related devices

SHEPPARD, MULLIN, RICHTER & HAMPTON llp A Limited Liability Partnership Including Professional Corporations MICHAEL H. AHRENS, Cal. Bar No. 44766 ORI KATZ, Cal. Bar No. 209561 ROBERT K. SAHYAN, Cal. Bar No. 253763 Four Embarcadero Center, 17th Floor San Francisco, California 94111-4106 Telephone: 415-434-9100 Facsimile: 415-434-3947

LICENSE AGREEMENT
License Agreement • December 19th, 2007 • Tvia Inc • Semiconductors & related devices • California

This License Agreement (the “Agreement”) is entered into as of November 30, 2007 (the “Signing Date”), by and between Tvia, Inc. (“Tvia”), a Delaware corporation having a place of business at 4001 Burton Drive, Santa Clara, CA 95054, and MediaTek USA Inc. (“Licensee”), a Delaware corporation having a place of business at 2860 Junction Ave. San Jose, CA 95134.

CONSULTING CONFIDENTIALITY AGREEMENT
Consulting Confidentiality Agreement • June 28th, 2002 • Tvia Inc • Semiconductors & related devices • California
Tvia, Inc. (Hefei) Co., Ltd. and MediaTek Inc. China ASSETS TRANSFER AGREEMENT
Assets Transfer Agreement • December 19th, 2007 • Tvia Inc • Semiconductors & related devices

Tvia, Inc. (Hefei) Co., Ltd., a wholly foreign-owned company duly established and validly existing under the laws of the People’s Republic of China having its legal address at Software Park, Hefei National New & High Technology Industrial Development Zone (“Tvia”); and

EXHIBIT 10.6 (graphic) UMC WAFER FOUNDRY STANDARD TERMS AND CONDITIONS
Foundry Services Agreement • May 1st, 2000 • Tvia Inc • Semiconductors & related devices
TVIA, INC. INDEMNIFICATION AGREEMENT
Indemnification Agreement • October 16th, 2008 • Tvia Inc • Semiconductors & related devices • Delaware

This Indemnification Agreement (“Agreement”) is made and entered into by and between Tvia, Inc., a Delaware corporation (the “Company”), and ___(“Indemnitee”), effective as of October 13, 2008.

EXECUTIVE SEVERANCE AGREEMENT
Executive Severance Agreement • March 17th, 2005 • Tvia Inc • Semiconductors & related devices • California

THIS EXECUTIVE SEVERANCE AGREEMENT (“Agreement”) is effective as of the 28st day of Sept, 2004 by and between Tvia, Inc., a California corporation (“Company”), and Benjamin Silva (the “Designated Officer”) for the purpose of setting forth the agreement between the Company and the Designated Officer regarding certain severance payments, as more fully described herein.

CONFIDENTIAL SEVERANCE AGREEMENT AND STATUS CHANGE RELEASE
Severance Agreement • March 17th, 2005 • Tvia Inc • Semiconductors & related devices • California

A general release does not extend to claims which the creditor does not know or suspect to exist in his favor at the time of executing the release, which if known by him must have materially affected his settlement with the debtor.

UNITED STATES BANKRUPTCY COURT NORTHERN DISTRICT OF CALIFORNIA SAN JOSE DIVISION
Official Committee of Equity Security Holders Representation Agreement • October 21st, 2009 • Tvia Inc • Semiconductors & related devices • California