NANOSYS, INC.Purchase Agreement • July 15th, 2004 • Nanosys Inc • Semiconductors & related devices • New York
Contract Type FiledJuly 15th, 2004 Company Industry Jurisdiction
EXHIBIT 10.7 LOAN AND SECURITY AGREEMENT This LOAN AND SECURITY AGREEMENT (This "Agreement") dated as of May 17, 2002, between SILICON VALLEY BANK, a California chartered bank, with its principal place of business at 3003 Tasman Drive, Santa Clara,...Loan and Security Agreement • April 22nd, 2004 • Nanosys Inc • Delaware
Contract Type FiledApril 22nd, 2004 Company Jurisdiction
EXHIBIT 4.2.1 WAIVER OF RIGHT OF FIRST OFFER AND AMENDMENT NO.1 TO SECOND AMENDED AND RESTATED INVESTORS' RIGHTS AGREEMENT WHEREAS, the undersigned In-Q- Tel, Inc., a Delaware corporation ("IQT") and Nanosys, Inc., a Delaware corporation (the...Investors' Rights Agreement • April 22nd, 2004 • Nanosys Inc
Contract Type FiledApril 22nd, 2004 Company
EXHIBIT 10.13 CONTRACT NUMBER: Nanosys DA-01 DEVELOPMENT AGREEMENT This Agreement (the "Agreement"), dated as of September 4, 2003 (the "Effective Date"), is between In-Q-Tel, Inc., a Delaware corporation ("In-Q-Tel") and Nanosys, Inc., a Delaware...Development Agreement • July 28th, 2004 • Nanosys Inc • Semiconductors & related devices • Virginia
Contract Type FiledJuly 28th, 2004 Company Industry Jurisdiction
FORLicense Agreement • July 28th, 2004 • Nanosys Inc • Semiconductors & related devices
Contract Type FiledJuly 28th, 2004 Company Industry
EXHIBIT 10.16 EXCLUSIVE LICENSE AGREEMENTExclusive License Agreement • July 6th, 2004 • Nanosys Inc • Semiconductors & related devices • California
Contract Type FiledJuly 6th, 2004 Company Industry Jurisdiction
1. THIS CONTRACT 18 A RATED ORDER RATING PAGE of PAGES AWARD / CONTRACT UNDER DPAS (15 CFR 350) - DO-A1 1 17 ------------------------------------------------ ------------------------------------------------------------------------------- -----Contract • July 6th, 2004 • Nanosys Inc • Semiconductors & related devices
Contract Type FiledJuly 6th, 2004 Company Industry
EXHIBIT 10.11 PATENT LICENSE AGREEMENT BETWEEN THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK AND NANOSYS, INC. This Agreement is entered into this 20th day of May, 2003 (the "Effective Date") by and between Nanosys, Inc. ("Licensee"), a...Patent License Agreement • August 3rd, 2004 • Nanosys Inc • Semiconductors & related devices • New York
Contract Type FiledAugust 3rd, 2004 Company Industry Jurisdiction
JOINDER AGREEMENT WHEREAS, the undersigned Silicon Valley Bank (the "Joining Party") and Nanosys, Inc., a Delaware corporation (the "Company"), have entered into a certain Loan and Security Agreement, dated as of May 17, 2002, and certain other...Joinder Agreement • April 22nd, 2004 • Nanosys Inc
Contract Type FiledApril 22nd, 2004 Company
EXHIBIT 10.8.1 AMENDMENT A TO LICENSE AGREEMENT This amendment agreement (the "Amendment A") is entered into by the parties to the existing license agreement effective November 9, 2002 (the "Prior Agreement") between The Regents of the University of...License Agreement • July 28th, 2004 • Nanosys Inc • Semiconductors & related devices
Contract Type FiledJuly 28th, 2004 Company Industry
EXHIBIT 10.3 SCIENTIFIC ADVISORY BOARD CONSULTING AGREEMENT This Agreement is made as of this __th day of ____________, 2004, between Nanosys, Inc., a Delaware corporation (the "Company"), and ___________________ (the "Consultant") and shall be...Consulting Agreement • May 27th, 2004 • Nanosys Inc • Semiconductors & related devices • Massachusetts
Contract Type FiledMay 27th, 2004 Company Industry Jurisdiction
INTRODUCTIONSubcontract Agreement • August 3rd, 2004 • Nanosys Inc • Semiconductors & related devices • Delaware
Contract Type FiledAugust 3rd, 2004 Company Industry Jurisdiction
EXHIBIT 10.10 MASSACHUSETTS INSTITUTE OF TECHNOLOGY EXCLUSIVE PATENT LICENSE AGREEMENTExclusive Patent License Agreement • June 25th, 2004 • Nanosys Inc • Semiconductors & related devices • Massachusetts
Contract Type FiledJune 25th, 2004 Company Industry Jurisdiction
RECITALSCooperative Development Agreement • August 3rd, 2004 • Nanosys Inc • Semiconductors & related devices • California
Contract Type FiledAugust 3rd, 2004 Company Industry Jurisdiction
EXHIBIT 10.12 SAIC/ NANOSYS MASTER MARKETING AND BUSINESS DEVELOPMENT AGREEMENT This Master Marketing Agreement ("Agreement"), is entered into as of the later of the dates set forth at the end of this Agreement (the "Effective Date"), by and between...Master Marketing Agreement • July 28th, 2004 • Nanosys Inc • Semiconductors & related devices • California
Contract Type FiledJuly 28th, 2004 Company Industry Jurisdiction
EXHIBIT 10.4 NANOSYS, INC. INDEMNIFICATION AGREEMENT This Indemnification Agreement ("AGREEMENT") is made as of this ___ day of ___________, ______, by and between Nanosys, Inc., a Delaware corporation (the "COMPANY"), and _____________________...Indemnification Agreement • April 22nd, 2004 • Nanosys Inc • Delaware
Contract Type FiledApril 22nd, 2004 Company Jurisdiction
EXHIBIT 10.17 NANOSYS/CW GROUP/LAWRENCE A. BOCK STATUS AGREEMENT This Agreement is effective as of February 10, 2004, by and among Nanosys, Inc., a Delaware corporation (the "Company"), Lawrence A. Bock ("LB"), CW Group, Inc., CW Ventures III, L.P.,...Status Agreement • May 27th, 2004 • Nanosys Inc • Semiconductors & related devices • California
Contract Type FiledMay 27th, 2004 Company Industry Jurisdiction
EXHIBIT 10.15.2 [NANOSYS LETTERHEAD] 2625 Hanover Street, Palo Alto, CA 94304 650.331.2100, 650.331.2101 fax, www.nanosysinc.com May 17, 2004 Dr. James Romine Director DuPont Materials Science & Engineering Experimental Station 328/407 Wilmington, DE...Dupont/Nanosys Collaboration Agreement • May 27th, 2004 • Nanosys Inc • Semiconductors & related devices
Contract Type FiledMay 27th, 2004 Company IndustryPursuant to section 10.2, of the Agreement, the Agreement is scheduled to terminate three months after the Commencement Date of the Agreement, which, as amended in Amendment A to the Agreement, is May 17th, 2004, unless the Parties have agreed in writing to continue the collaboration under the Agreement.