ContractVerisilicon Holdings Co LTD • October 31st, 2014 • Semiconductors & related devices • California
THIS WARRANT AND THE UNDERLYING SECURITIES HAVE NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933, AS AMENDED (THE “ACT”), OR UNDER THE SECURITIES LAWS OF ANY STATE. THESE SECURITIES MAY NOT BE OFFERED, SOLD OR OTHERWISE TRANSFERRED, PLEDGED OR HYPOTHECATED EXCEPT AS PERMITTED UNDER THE ACT AND APPLICABLE STATE SECURITIES LAWS IN ACCORDANCE WITH APPLICABLE REGISTRATION REQUIREMENTS OR AN EXEMPTION THEREFROM. THE ISSUER OF THESE SECURITIES MAY REQUIRE AN OPINION OF COUNSEL REASONABLY SATISFACTORY TO THE ISSUER THAT SUCH OFFER, SALE, TRANSFER, PLEDGE OR HYPOTHECATION OTHERWISE COMPLIES WITH THE ACT AND ANY APPLICABLE STATE SECURITIES LAWS. THIS WARRANT MUST BE SURRENDERED TO THE COMPANY OR ITS TRANSFER AGENT AS A CONDITION PRECEDENT TO THE SALE, TRANSFER, PLEDGE OR HYPOTHECATION OF ANY INTEREST IN ANY OF THE SECURITIES REPRESENTED HEREBY.
SEVENTH LOAN MODIFICATION AGREEMENTSeventh Loan Modification Agreement • October 31st, 2014 • Verisilicon Holdings Co LTD • Semiconductors & related devices • California
This Seventh Loan Modification Agreement (“Agreement”) is made as of April 15, 2013, by and among CATHAY BANK (“Bank”), VERISILICON, INC. (“Company”), VERISILICON HOLDINGS CO., LTD, formerly known as VERISILICON HOLDINGS (Cayman Islands) Co., Ltd. (“Parent”) and VERISILICON (HONG KONG) LIMITED (“Hong Kong” and together with Company and Parent, the “Borrowers” and each a “Borrower”).
EIGHTH LOAN MODIFICATION AGREEMENTEighth Loan Modification Agreement • October 31st, 2014 • Verisilicon Holdings Co LTD • Semiconductors & related devices • California
This Eighth Loan Modification Agreement (“Agreement”) is made as of April 15, 2014, by and among CATHAY BANK (“Bank”), VERISILICON, INC. (“Company”), VERISILICON HOLDINGS CO., LTD, formerly known as VERISILICON HOLDINGS (Cayman Islands) Co., Ltd. (“Parent”) and VERISILICON (HONG KONG) LIMITED (“Hong Kong” and together with Company and Parent, the “Borrowers” and each a “Borrower”).
TECHNOLOGY LICENSE AGREEMENTTechnology License Agreement • October 16th, 2014 • Verisilicon Holdings Co LTD • Semiconductors & related devices • California
This TECHNOLOGY LICENSE AGREEMENT (“Agreement”) effective as of this 30th day of June, 2006 (the “Effective Date”), is entered into by and between (i) LSI Logic Corporation, a Delaware corporation, with its principal place of business at 1621 Barber Lane, MS D-106, Milpitas, California 95035 (“LSI US”) and LSI Logic HK Holdings, an exempted company with limited liability under the laws of Cayman Islands and a wholly-owned subsidiary of LSI US, with its principal place of business at PO Box 1034GT, Harbour Place, 4th Floor, 103 South Church Street, George Town, Grand Cayman, Cayman Islands (“LSI Cayman”; together with LSI US being the “LSI Parties”), on the one hand, and (ii) and VeriSilicon Holdings (Cayman Islands) Co., Ltd., an exempted company with limited liability under the laws of the Cayman Islands with its principal place of business at 4699 Old Ironsides Drive, Suite 270, Santa Clara, California 95054 (“VSI”), on the other hand.
SIXTH LOAN MODIFICATION AGREEMENTSixth Loan Modification Agreement • May 19th, 2015 • Verisilicon Holdings Co LTD • Semiconductors & related devices • California
This Sixth Loan Modification Agreement (“Agreement”) is made as of August 17, 2012, by and among CATHAY BANK (“Bank”), VERISILICON, INC. (“Company”), VERISILICON HOLDINGS CO., LTD, formerly known as VERISILICON HOLDINGS (Cayman Islands) Co., Ltd. (“Parent”) and VERISILICON (HONG KONG) LIMITED (“Hong Kong” and together with Company and Parent, the “Borrowers” and each a “Borrower”).
FIFTH LOAN MODIFICATION AGREEMENTFifth Loan Modification Agreement • May 19th, 2015 • Verisilicon Holdings Co LTD • Semiconductors & related devices • California
This Fifth Loan Modification Agreement (“Agreement”) is made as of March 14, 2012, by and among CATHAY BANK (“Bank”), VERISILICON, INC. (“Company”), VERISILICON HOLDINGS CO., LTD, formerly known as VERISILICON HOLDINGS (Cayman Islands) Co., Ltd. (“Parent”) and VERISILICON (HONG KONG) LIMITED (“Hong Kong” and together with Company and Parent, the “Borrowers” and each a “Borrower”).
SIXTH LOAN EXTENSION AGREEMENTSixth Loan Extension Agreement • May 19th, 2015 • Verisilicon Holdings Co LTD • Semiconductors & related devices • California
This Sixth Loan Extension Agreement (“Agreement”) is made as of April 21, 2015, by and among CATHAY BANK (“Bank”), VERISILICON, INC. (“Company”), VERISILICON HOLDINGS CO., LTD, formerly known as VERISILICON HOLDINGS (Cayman Islands) Co., Ltd. (“Parent”) and VERISILICON (HONG KONG) LIMITED (“Hong Kong” and together with Company and Parent, the “Borrowers” and each a “Borrower”).
FOURTH LOAN EXTENSION AGREEMENTFourth Loan Extension Agreement • May 19th, 2015 • Verisilicon Holdings Co LTD • Semiconductors & related devices • California
This Fourth Loan Extension Agreement (“Agreement”) is made as of November 30, 2011, by and among CATHAY BANK (“Bank”), VERISILICON, INC. (“Company”) and VERISILICON HOLDINGS CO., LTD, formerly known as VERISILICON HOLDINGS (Cayman Islands) Co., Ltd. (“Parent” and together with Company, the “Borrowers’’ and each a “Borrower”).
INDEMNIFICATION AGREEMENTIndemnification Agreement • October 31st, 2014 • Verisilicon Holdings Co LTD • Semiconductors & related devices
THIS INDEMNIFICATION AGREEMENT (“Agreement”) is made as of [ ], 2014 by and between VeriSilicon Holdings Co., Ltd., a Cayman Islands company, (the “Company”), and [ ], a director and/or officer of the Company (the “Indemnitee”).
VeriSilicon, Inc. VeriSilicon Holdings (Cayman Islands) Co., Ltd. LOAN AND SECURITY AGREEMENTLoan and Security Agreement • October 31st, 2014 • Verisilicon Holdings Co LTD • Semiconductors & related devices • California
This LOAN AND SECURITY AGREEMENT is entered into as of June 27, 2008, by and among CATHAY BANK (“Bank”), VERISILICON, INC. (“Company”) and VERISILICON HOLDINGS (Cayman Islands) Co., Ltd. (“Parent” and together with Company, the “Borrowers” and each a “Borrower”).
SECOND LOAN MODIFICATION AGREEMENTSecond Loan Modification Agreement • May 19th, 2015 • Verisilicon Holdings Co LTD • Semiconductors & related devices • California
This Second Loan Modification Agreement (“Agreement”) is made as of July 1, 2010, by and among CATHAY BANK (“Bank”), VERISILICON, INC. (“Company”) and VERISILICON HOLDINGS CO., LTD, formerly known as VERISILICON HOLDINGS (Cayman Islands) Co., Ltd. (“Parent” and together with Company, the “Borrowers” and each a “Borrower”).
