Dated 4 June 2014 (1) SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and (2) DATANG HOLDINGS (HONGKONG) INVESTMENT COMPANY LIMITED and (3) DEUTSCHE BANK AG, HONG KONG BRANCH and (4) J.P. MORGAN SECURITIES (ASIA PACIFIC) LIMITED PLACING AND...
Placing and Subscription Agreement • April 28th, 2015 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
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April 28th, 2015
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PLACING AND SUBSCRIPTION AGREEMENT, made on 27 October 2021 AMONG
Placing and Subscription Agreement • October 28th, 2021 • Hong Kong
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October 28th, 2021
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Placing and Subscription Agreement Sample Contracts

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