EXHIBIT 10.1 CHANGE IN TERMS AGREEMENTChange in Terms Agreement • August 13th, 2002 • Hytek Microsystems Inc • Semiconductors & related devices
Principal Amount: $500,000.00 Initial Rate: 6.25% Date of Agreement: May 22, 2002 Description of Existing Indebtedness: Promissory Note dated May 21, 2001 in the amount of $1,000,000.00 Description of Collateral: Commercial Security Agreement dated May 16, 2000. Description of Change in Terms. 1. The principal amount of the Promissory Note shall be decreased from $1,000,000.00 to $500,000.00. 2. The interest rate shall be changed from Bank of the West prime rate to Bank of the West prime rate plus 1.5% effective May 16, 2002. 3. The Business Loan Agreement dated May 21, 2001 is hereby terminated and replaced with Business Loan Agreement dated May 22, 2002. 4. Borrower shall pay Lender a Documentation Fee in the amount of $200.00 and a Revision Fee in the amount of $1,000.00 prior to this Change in Terms Agreement being processed. Continuing Validity. Except as expressly changed by this Agreement, the terms of the original obligation or obligations, including all agreements evidenced or
HYTEK MICROSYSTEMS, INC. EXHIBIT 10.3 DIRECTOR'S NONSTATUTORY STOCK OPTION AGREEMENT (Subsequent Option) Hytek Microsystems, Inc., a California corporation (the "Company"), has granted to ________________________(the "Optionee") an option to purchase...Nonstatutory Stock Option Agreement • November 12th, 1997 • Hytek Microsystems Inc • Semiconductors & related devices
Date or Event Amount Upon execution of this Agreement by $300,000.00 ($272,629.53 Principal + authorized representatives of the parti $27,370.47 Interest @ 9.5%) 30 September 1999 25,212.16 (Interest @ 9.5%) 29 October 1999 25,212.16 (Interest @ 9.5%)...Final Settlement Agreement • November 15th, 1999 • Hytek Microsystems Inc • Semiconductors & related devices
HYTEK MICROSYSTEMS, INC. INDEMNIFICATION AGREEMENTIndemnification Agreement • August 17th, 2004 • Hytek Microsystems Inc • Semiconductors & related devices • California
This Indemnification Agreement (“Agreement”) is made as of , 2004 by and between Hytek Microsystems, Inc., a California corporation (the “Company”), and (“Indemnitee”).
BUSINESS LOAN AGREEMENTLoan Agreement • March 28th, 2005 • Hytek Microsystems Inc • Semiconductors & related devices • Nevada
THIS BUSINESS LOAN AGREEMENT dated May 22, 2002, is made and executed between HYTEK MICROSYSTEMS INC. (“Borrower”) and BANK OF THE WEST (“Lender”) on the following terms and conditions. Borrower has received prior commercial loans from Lender or has applied to Lender for a commercial loan or loans or other financial accommodations, including those which may be described on any exhibit or schedule attached to this Agreement (“Loan”). Borrower understands and agrees that; (A) in granting, renewing, or extending any Loan, Lender is relying upon Borrower’s representations, warranties, and agreements as set forth in this Agreement; (B) the granting, renewing, or extending of any Loan by Lender at all times shall be subject to Lender’s sole judgment and discretion; and (C) all such Loans shall be and remain subject to the terms and conditions of this Agreement.
LEASE AGREEMENT EXTENSIONLease Agreement Extension • May 18th, 2004 • Hytek Microsystems Inc • Semiconductors & related devices
This Lease Extension Agreement entered into by The Mallard Company as Landlord/Lessor and HYTEK, Inc., as Tenant/Lessee with reference to the following:
Amendment Number 2 To Final Settlement Agreement Re Cancellation of Syntron, Inc. Purchase Orders 45224 & 203491Final Settlement Agreement • April 2nd, 2004 • Hytek Microsystems Inc • Semiconductors & related devices
This Amendment Number 2 modifies the Final Settlement Agreement Re Cancellation of Syntron, Inc. Purchase Orders 45224 & 203491 between Chesapeake Sciences Corporation and Syntron, Inc. and Amendment 1 thereto. The Final Settlement Agreement Re Cancellation of Syntron, Inc. Purchase Orders 45224 & 203491 between Chesapeake Sciences Corporation and Syntron, Inc., Amendment Number 1 thereto, and this Amendment Number 2 shall be referred to collectively as the “Agreement”. Chesapeake Sciences Corporation, Syntron, Inc., Hytek Microsystems Incorporated and Sercel, Inc. agree as follows:
Amendment Number 1 To Final Settlement Agreement Re Cancellation of Syntron, Inc. Purchase Orders 45224 & 203491Final Settlement Agreement • April 2nd, 2004 • Hytek Microsystems Inc • Semiconductors & related devices
This Amendment Number 1 modifies the Final Settlement Agreement Re Cancellation of Syntron, Inc. Purchase Orders 45224 & 203491 between Chesapeake Sciences Corporation and Syntron, Inc. The Final Settlement Agreement Re Cancellation of Syntron, Inc. Purchase Orders 45224 & 203491 and this Amendment Number 1 shall be referred to collectively as the “Agreement”. Chesapeake Sciences Corporation and Syntron, Inc. agree as follows:
SEPARATION AGREEMENT AND RELEASE RECITALSSeparation Agreement and Release • May 13th, 2003 • Hytek Microsystems Inc • Semiconductors & related devices • Nevada
This Separation Agreement and Release (“Agreement”) is made by and between Charles S. Byrne (“Employee”) and Hytek Microsystems, Inc. (“Company”) (jointly referred to as the “Parties”):
HYTEK MICROSYSTEMS, INC.General Release • March 28th, 2005 • Hytek Microsystems Inc • Semiconductors & related devices
As you know, Hytek Microsystems, Inc., a California corporation (“we” or “Hytek”), has entered into an Agreement and Plan of Merger with Natel Engineering Company, Inc., a California corporation (“Natel”), pursuant to which Hytek will become a wholly-owned subsidiary of Natel if and when the merger is consummated (the “Merger”). We wish to take appropriate steps to reinforce and encourage your continued dedication to Hytek following the Merger. As used in this letter, the “First Year” means the first year after the consummation of the Merger and the “Second Year” means the second year after the consummation of the Merger.
SUPPLY AGREEMENTSupply Agreement • March 28th, 2005 • Hytek Microsystems Inc • Semiconductors & related devices • Minnesota
SETTLEMENT AGREEMENT Sally Chapman Hytek MicrosystemsSettlement Agreement • April 2nd, 2004 • Hytek Microsystems Inc • Semiconductors & related devices
The undersigned agree that the above referenced litigation, and all claims which were and could have been raised therein, is settled upon the following terms:
AGREEMENT AND PLAN OF MERGER BY AND AMONG NATEL ENGINEERING COMPANY, INC., NATEL MERGER SUB AND HYTEK MICROSYSTEMS, INC. February 11, 2005Agreement and Plan of Merger • February 14th, 2005 • Hytek Microsystems Inc • Semiconductors & related devices • California
THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”), is dated as of February 11, 2005, by and among NATEL Engineering Company, Inc., a California corporation (“Parent”), Natel Merger Sub, a California corporation (“Merger Sub”), and Hytek Microsystems, Inc., a California corporation (the “Company”).
Amendment Number 3 To Final Settlement Agreement Re Cancellation of Syntron, Inc. Purchase Orders 45224 & 203491Final Settlement Agreement • March 28th, 2005 • Hytek Microsystems Inc • Semiconductors & related devices
Amendment Number 3 modifies the Final Settlement Agreement as amended to incorporate a revised pricing agreement between Sercel, Inc. (Sercel) and Hytek, Microsystems, Inc. (Hytek). Also, the monthly storage fee of $400 for the Sercel, Inc. owned parts is reduced.
