Power Integrations Inc Sample Contracts
EXHIBIT 10.29 [LETTERHEAD OF UNION BANK OF CALIFORNIA] August 1, 2000 Mr. Robert Staples Chief Financial Officer Power Integrations, Inc. 477 North Mathilda Avenue Sunnyvale, CA 94086 Re: First Amendment ("Amendment") to the Loan Agreement dated...Loan Agreement • November 14th, 2000 • Power Integrations Inc • Semiconductors & related devices
Standard Contracts
ANDRights Agreement • March 12th, 1999 • Power Integrations Inc • Semiconductors & related devices • Delaware
Exhibit 4.3 AMENDMENT TO RIGHTS AGREEMENT 1. General Background. In accordance with Section 27 of the Rights ------------------ Agreement between Bank Boston, N. A. (the "Rights Agent") and Power Integrations, Inc. dated February 24, 1999 (the...Rights Agreement • November 9th, 2001 • Power Integrations Inc • Semiconductors & related devices
SUBLEASE Sublessor: At Web, Inc. Subleased Premises: 686 West Maude, Sunnyvale, CASublease • November 9th, 1999 • Power Integrations Inc • Semiconductors & related devices
EXHIBIT 4.2 POWER INTEGRATIONS, INC. INVESTOR'S RIGHTS AGREEMENT May 22, 1996 TABLE OF CONTENTS -----------------Investor's Rights Agreement • September 11th, 1997 • Power Integrations Inc • California
EXHIBIT 10.10 MASTER LEASE AGREEMENT THIS MASTER LEASE AGREEMENT (THE "LEASE") IS MADE THE 3RD DAY OF SEPTEMBER, 1996 BETWEEN LEASING TECHNOLOGIES INTERNATIONAL, INC., WITH ITS PRINCIPAL OFFICE AT SOUNDVIEW PLAZA, 1266 MAIN STREET, STAMFORD, CT 06902...Master Lease Agreement • September 11th, 1997 • Power Integrations Inc • Connecticut
AMENDMENT NUMBER TWO TO LICENSING AND WAFER SUPPLY AGREEMENTLicensing Agreement • August 12th, 1998 • Power Integrations Inc • Semiconductors & related devices • California
EXHIBIT 10.23 LOAN AGREEMENTLoan Agreement • March 16th, 1999 • Power Integrations Inc • Semiconductors & related devices • California
EXHIBIT 1.1 POWER INTEGRATIONS, INC. ________________ SHARES COMMON STOCK UNDERWRITING AGREEMENT ----------------------Underwriting Agreement • September 11th, 1997 • Power Integrations Inc • California
FIFTH AMENDED AND RESTATED RIGHTS AGREEMENT ----------------Rights Agreement • October 21st, 1997 • Power Integrations Inc • Semiconductors & related devices • California
AGREEMENT ---------Indemnity Agreement • September 11th, 1997 • Power Integrations Inc • Delaware
EXHIBIT 10.28 *** PORTIONS OF THIS EXHIBIT HAVE BEEN DELETED PURSUANT TO A REQUEST FOR CONFIDENTIAL TREATMENT. THE CONFIDENTIAL PORTIONS HAVE BEEN FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION. TECHNOLOGY LICENSE AGREEMENT...Technology License Agreement • November 14th, 2000 • Power Integrations Inc • Semiconductors & related devices • California
FIFTH AMENDED AND RESTATED RIGHTS AGREEMENT ----------------Rights Agreement • September 11th, 1997 • Power Integrations Inc • California
EXHIBIT 10.18 INDUSTRIAL BUILDING LEASE THIS INDUSTRIAL BUILDING LEASE ("Lease") is made and entered into this 3rd day of June, 1998, by and between MATHILDA DEVELOPMENT, a California Limited Partnership, hereinafter called "Lessor", and POWER...Industrial Building Lease • August 12th, 1998 • Power Integrations Inc • Semiconductors & related devices • California
EXHIBIT 10.22 MASTER EQUIPMENT LEASE AGREEMENT THIS AGREEMENT is entered into the 31st day of July, 1998 between METLIFE CAPITAL, LIMITED PARTNERSHIP ("Lessor") whose address is 10900 N.E. 4th St., Suite 500, mailing address C-97550, Bellevue,...Master Equipment Lease Agreement • November 10th, 1998 • Power Integrations Inc • Semiconductors & related devices • Washington
2. Unvested Share Repurchase Option. In the event the Purchaser's -------------------------------- employment with the Company is terminated for any reason (other than death or disability), with or without cause, or if the Purchaser or the Purchaser's...Founder Stock Purchase Agreement • September 11th, 1997 • Power Integrations Inc • California
EXHIBIT 10.24 AMENDMENT NUMBER ONE TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • May 10th, 1999 • Power Integrations Inc • Semiconductors & related devices • California
POWER INTEGRATIONS, INC. EXECUTIVE OFFICER BENEFITS AGREEMENTExecutive Officer Benefits Agreement • July 29th, 2021 • Power Integrations Inc • Semiconductors & related devices • California
This Executive Officer Benefits Agreement (the “Agreement”) is made and entered into as of June 14, 2021 (the “Effective Date”), by and between Power Integrations, Inc., a Delaware corporation, (the “Company”) and Yang Chiah Yee (“Executive”).
1. Bank hereby commits, subject to all the terms and conditions of this Agreement and prior to the termination of its commitment as hereinafter provided, to make loans to Borrower from time to time in amounts up to, but not exceeding in the aggregate...Security and Loan Agreement • November 10th, 1997 • Power Integrations Inc • Semiconductors & related devices
POWER INTEGRATIONS, INC. EXECUTIVE OFFICER BENEFITS AGREEMENTExecutive Officer Benefits Agreement • August 6th, 2010 • Power Integrations Inc • Semiconductors & related devices • California
THIS EXECUTIVE OFFICER BENEFITS AGREEMENT (the “Agreement”) is made and entered into as of July 22, 2010 (the “Effective Date”), by and between POWER INTEGRATIONS, INC., a Delaware corporation, (the “Company”) and SANDEEP NAYYAR (“Executive”).
POWER INTEGRATIONS, INC. EXECUTIVE OFFICER BENEFITS AGREEMENTExecutive Officer Benefits Agreement • November 1st, 2013 • Power Integrations Inc • Semiconductors & related devices • California
This Executive Officer Benefits Agreement (the “Agreement”) is made and entered into as of July 26, 2013 (the “Effective Date”), by and between Power Integrations, Inc., a Delaware corporation, (the “Company”) and Mike Matthews, (“Executive”).
CREDIT AGREEMENTCredit Agreement • May 8th, 2012 • Power Integrations Inc • Semiconductors & related devices • California
THIS CREDIT AGREEMENT (this "Agreement") is entered into as of February 22, 2011, by and between POWER INTEGRATIONS, INC., a Delaware corporation ("Borrower"), and WELLS FARGO BANK, NATIONAL ASSOCIATION ("Bank").
Exhibit 10.17 EXECUTIVE OFFICER BENEFITS AGREEMENT This Executive Officer Benefits Agreement (the "Agreement") is made and entered into as of April 25, 2002 (the "Effective Date"), by and between Power Integrations, Inc., a Delaware corporation and...Executive Officer Benefits Agreement • May 10th, 2002 • Power Integrations Inc • Semiconductors & related devices • California
WITNESSETH: ----------Founder Stock Purchase Agreement • September 11th, 1997 • Power Integrations Inc • California
AMENDED AND RESTATED EXECUTIVE OFFICER BENEFITS AGREEMENTExecutive Officer Benefits Agreement • July 31st, 2020 • Power Integrations Inc • Semiconductors & related devices • California
This AMENDMENT TO THE AMENDED AND RESTATED EXECUTIVE OFFICER BENEFITS AGREEMENT (this "Amendment') is made and entered into as of June 1, 2020 by and between Power Integrations, Inc., a Delaware Corporation (the "Company") and Doug Bailey ("Executive").
WITNESSETH: ----------Merger Agreement • September 11th, 1997 • Power Integrations Inc
POWER INTEGRATIONS, INC. IMMEDIATELY EXERCISABLE NONSTATUTORY STOCK OPTION AGREEMENT (EXECUTIVE)Nonstatutory Stock Option Agreement • August 8th, 2007 • Power Integrations Inc • Semiconductors & related devices • California
THIS IMMEDIATELY EXERCISABLE NONSTATUTORY STOCK OPTION AGREEMENT (the “Option Agreement”) is made and entered into as of XXXXX, by and between Power Integrations, Inc. and XXXXXX (the “Optionee”).
EXHIBIT 10.17 ADDENDUM TO SECURITY AND LOAN AGREEMENT ("SECURITY AND LOAN AGREEMENT") BETWEEN POWER INTEGRATIONS, INC. AND IMPERIAL BANK DATED AUGUST 12, 1997 This Addendum is made and entered into August 12, 1997, between Power Integrations, Inc....Security and Loan Agreement • October 21st, 1997 • Power Integrations Inc • Semiconductors & related devices
RECITALS --------Wafer Foundry Agreement • November 14th, 2000 • Power Integrations Inc • Semiconductors & related devices • California
Form of Agreement for Employees with Executive Officer Benefits Agreement] Power Integrations, Inc.Long Term Performance Stock Unit Grant Agreement • February 7th, 2022 • Power Integrations Inc • Semiconductors & related devices • Delaware
Power Integrations, Inc. (the “Company”), pursuant to its 2016 Incentive Award Plan (the “Plan”) hereby grants to Participant the Maximum Number of Long Term Performance Stock Units (“PRSUs”) as set forth below (the “PRSU Grant”). This PRSU Grant is subject to all of the terms and conditions as set forth herein, and in the Long Term Performance Stock Unit Agreement and the Plan, each of which is attached hereto and incorporated herein in its entirety. This PRSU Grant is a “performance stock unit” granted pursuant to Section 5(b) of the Plan. Capitalized terms not otherwise defined herein will have the meanings set forth in the Plan or the Long Term Performance Stock Unit Agreement. Except as otherwise expressly provided herein, in the event of any conflict between the terms in the PRSU Grant and the Plan, the terms of the Plan will control.
AMENDMENT NUMBER ONE TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • September 19th, 2014 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number One to Wafer Supply Agreement (the “Amendment”), effective as of January 1, 2014 (the “Amendment Effective Date”), amends the Wafer Supply Agreement effective October 1, 2010 (the “Agreement”) by and between:
Form of Agreement for Employees with Executive Officer Benefits Agreement]Performance Stock Unit Grant Agreement • February 8th, 2017 • Power Integrations Inc • Semiconductors & related devices • Delaware
Power Integrations, Inc. (the “Company”), pursuant to its 2016 Incentive Award Plan (the “Plan”) hereby grants to Participant the Maximum Number of Performance Stock Units as set forth below (the “PSU Grant”). This PSU Grant is subject to all of the terms and conditions as set forth herein, and in the Performance Stock Unit Agreement and the Plan, each of which is attached hereto and incorporated herein in its entirety. This PSU Grant is a “performance stock unit” granted pursuant to Section 5(b) of the Plan. Capitalized terms not otherwise defined herein will have the meanings set forth in the Plan or the Performance Stock Unit Agreement. Except as otherwise expressly provided herein, in the event of any conflict between the terms in the PSU Grant and the Plan, the terms of the Plan will control.
ContractWafer Supply Agreement • February 10th, 2015 • Power Integrations Inc • Semiconductors & related devices • California
[*] = Certain confidential information contained in this document, marked by brackets, is filed with the Securities and Exchange Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended.
EXHIBIT 10.9 MASTER EQUIPMENT LEASE AGREEMENT DATED AS OFMaster Equipment Lease Agreement • September 11th, 1997 • Power Integrations Inc • Connecticut
PURCHASE AGREEMENTPurchase Agreement • August 7th, 2003 • Power Integrations Inc • Semiconductors & related devices • California
THIS PURCHASE AGREEMENT (“Agreement”) is made and entered into as of April 21, 2003 (the “Effective Date”), by and between SPI HO II ASSOCIATES, L.P., a California limited partnership, as to an undivided 20.83% interest, SPI/TSA ARROWHEAD, LLC, an Arizona limited liability company, as to an undivided 15.67% interest, SPI/TSA CHULA VISTA L.P., a California limited partnership, as to an undivided 33% interest, and SPI/BRAINTREE UNIT 5 LIMITED PARTNERSHIP, a Massachusetts limited partnership, as to an undivided 30.50% interest (collectively “Seller”), and POWER INTEGRATIONS, INC., a Delaware corporation (“Buyer”).
