Standard Contracts
Exhibit 10.17 WAFER SUPPLY AGREEMENT PARTIES: 1.JIANGXI LDK Solar Hi-Tech Co., Ltd, a company organized and existing under the laws of P.R. China, with its registered office at HIGH TECHNOLOGY INDUSTRIAL PARK, XINYU CITY,JIANGXl PROVINCE, PC 215128,...Wafer Supply Agreement • May 25th, 2007 • LDK Solar Co., Ltd. • Semiconductors & related devices
EX-10.5 6 dex105.htm WAFER SUPPLY AGREEMENT WAFER SUPPLY AGREEMENTWafer Supply Agreement • May 5th, 2020 • New York
This WAFER SUPPLY AGREEMENT (this “Agreement”) is made this 2nd day of March, 2009, (the “Effective Date”), by and among (i) Advanced Micro Devices, Inc., a Delaware corporation (“AMD”); (ii) with respect to all of the provisions in this Agreement other than those in Sections 5.5(a), 6.2, 7.1 and 7.3(a) and the related provisions in connection with U.S. sales activities only (though without limiting FoundryCo’s guarantee obligations pursuant to Section 15.7), The Foundry Company, an exempted company incorporated under the laws of the Cayman Islands (“FoundryCo”) on behalf of itself and its direct and indirect wholly-owned subsidiaries, including all FoundryCo Sales Entities and FoundryCo Manufacturing Entities, as further set forth herein; and (iii) subject to FoundryCo’s guarantee obligations pursuant to Section 15.7, with respect to Sections 5.5(a), 6.2, 7.1 and 7.3(a) and the related provisions in connection with U.S. sales activities only, AMD Fab Technologies US, Inc., a Delaware
EX-10.1 2 dex101.htm WAFER SUPPLY AGREEMENT Execution Copy WAFER SUPPLY AGREEMENT AMENDMENT NO. 1Wafer Supply Agreement • May 5th, 2020
This First Amendment to the WAFER SUPPLY AGREEMENT (this “Amendment”), dated as of March 29, 2011, amends that certain Wafer Supply Agreement, dated March 2, 2009, (the “Agreement”) by and among (i) Advanced Micro Devices, Inc., a Delaware corporation (“AMD”); (ii) with respect to all of the provisions in the Agreement other than those in Sections 5.5(a), 6.2 and 7.3(a) of the Agreement and the related provisions of the Agreement in connection with sales activities only (though without limiting FoundryCo’s guarantee obligations pursuant to Section 15.7 of the Agreement), GLOBALFOUNDRIES Inc., an exempted company incorporated under the laws of the Cayman Islands (“FoundryCo”), on behalf of itself and its direct and indirect wholly-owned subsidiaries, including all FoundryCo Sales Entities and FoundryCo Manufacturing Entities, as further set forth in the Agreement; (iii) subject to FoundryCo’s guarantee obligations pursuant to Section 15.7 of the Agreement, GLOBALFOUNDRIES U.S. Inc., a D
AMENDMENT NUMBER ONE TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • September 19th, 2014 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number One to Wafer Supply Agreement (the “Amendment”), effective as of January 1, 2014 (the “Amendment Effective Date”), amends the Wafer Supply Agreement effective October 1, 2010 (the “Agreement”) by and between:
HHNEC WAFER SUPPLY AGREEMENTWafer Supply Agreement • June 22nd, 2006 • Jazz Semiconductor Inc • Semiconductors & related devices • California
THIS AGREEMENT, is made and entered into this 29 day of August, 2003 (“Effective Date”) by and between JAZZ/HUA HONG, LLC, a limited liability company organized in the State of Delaware (the “LLC”), NEWPORT FAB, LLC, a Delaware limited liability company d/b/a Jazz Semiconductor (“Jazz”) and SHANGHAI HUA HONG NEC ELECTRONICS COMPANY., LIMITED., a corporation formed under the laws of the Peoples Republic of China (“HHNEC”) (hereinafter LLC Jazz and HHNEC may each be referred to as a “party” and may be jointly referred to as “parties”).
AMENDED AND RESTATED WAFER SUPPLY AGREEMENT NO. 3Wafer Supply Agreement • March 28th, 2017 • Micron Technology Inc • Semiconductors & related devices • Delaware
This AMENDED AND RESTATED WAFER SUPPLY AGREEMENT NO. 3 (this “Agreement”) is made and entered into as of February 10, 2017 (the “Effective Date”). This Agreement amends and restates in its entirety Wafer Supply Agreement No. 3, dated as of September 1, 2015, by and between Intel Corporation, a Delaware corporation (“Intel”), Micron Semiconductor Asia Pte. Ltd., a Singapore corporation (“MSA”) and Micron Technology, Inc., a Delaware corporation (“MTI” and, together with MSA, collectively, “Micron”). Each of Intel, MSA and MTI may be referred to herein individually as a “Party” and collectively as the “Parties.”
ContractWafer Supply Agreement • February 10th, 2015 • Power Integrations Inc • Semiconductors & related devices • California
[*] = Certain confidential information contained in this document, marked by brackets, is filed with the Securities and Exchange Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended.
ContractWafer Supply Agreement • May 5th, 2020 • North Carolina
EX-10.1 2 ex-101wafersupplyagreement.htm EXHIBIT 10.1 CERTAIN CONFIDENTIAL MATERIAL APPEARING IN THIS DOCUMENT, MARKED BY ***, HAS BEEN OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT TO RULE 24B-2 PROMULGATED UNDER THE SECURITIES EXCHANGE ACT OF 1934, AS AMENDED. EXHIBIT 10.1 EXECUTION VERSION WAFER SUPPLY AGREEMENT This Wafer Supply Agreement (the “Agreement”) is made and entered as of the 9th day of June, 2012, by and between:
WAFER SUPPLY AGREEMENTWafer Supply Agreement • November 20th, 2012 • Micron Technology Inc • Semiconductors & related devices • Delaware
This WAFER SUPPLY AGREEMENT (this “Agreement”) is made and entered into as of this 6th day of April, 2012 (the “Effective Date”), by and between Intel Corporation, a Delaware corporation (“Intel”), Micron Semiconductor Asia Pte. Ltd., a Singapore corporation (“MSA”) and Micron Technology, Inc., a Delaware corporation (“MTI” and, together with MSA, collectively, “Micron”). Each of Intel, MSA and MTI may be referred to herein individually as a “Party” and collectively as the “Parties”.
WAFER SUPPLY AGREEMENT AMENDMENT NO. 4Wafer Supply Agreement • August 12th, 2014 • Advanced Micro Devices Inc • Semiconductors & related devices
This Fourth Amendment to the WAFER SUPPLY AGREEMENT (this “Fourth Amendment”), dated as of March 30, 2014, amends that certain Wafer Supply Agreement, dated March 2, 2009 (the “Original WSA,” as amended to the date hereof including this Fourth Amendment, the “Agreement”) by and among (i) Advanced Micro Devices, Inc., a Delaware corporation (“AMD”); (ii) with respect to all of the provisions in the Agreement other than those in Sections 5.5(a), 6.2 and 7.3(a) of the Agreement and the related provisions of the Agreement in connection with sales activities only (though without limiting FoundryCo’s guarantee obligations pursuant to Section 15.7 of the Agreement), GLOBALFOUNDRIES Inc., an exempted company incorporated under the laws of the Cayman Islands (“FoundryCo”), on behalf of itself and its direct and indirect wholly-owned subsidiaries, including all FoundryCo Sales Entities and FoundryCo Manufacturing Entities, as further set forth in the Agreement; and (iii) subject to FoundryCo’s g
CONFIDENTIAL WAFER SUPPLY AGREEMENT between:Wafer Supply Agreement • June 22nd, 2006 • Jazz Semiconductor Inc • Semiconductors & related devices • Delaware
THIS WAFER SUPPLY AGREEMENT (this “Supply Agreement”) is entered into as of October 15, 2002 (the “Effective Date”) by and between NEWPORT FAB, LLC, a Delaware limited liability company d/b/a Jazz Semiconductor (“JAZZ”) and RF MICRO DEVICES, INC., a North Carolina corporation (“RFMD”).
ContractWafer Supply Agreement • May 5th, 2020
EX-10.3 5 wsaamendmentno6redacted.htm EXHIBIT 10.3 Exhibit 10.3 WAFER SUPPLY AGREEMENT AMENDMENT NO. 6 This Sixth Amendment to the WAFER SUPPLY AGREEMENT (this “Sixth Amendment”), dated as of August 30, 2016, amends that certain Wafer Supply Agreement, dated March 2, 2009 (the “Original WSA,” as amended by this Sixth Amendment, the “Agreement”), as previously amended by Wafer Supply Agreement Amendment No. 1 dated as of April 2, 2011, Wafer Supply Agreement Amendment No. 2 dated as of March 4, 2012, Wafer Supply Agreement Amendment No. 3 dated as of December 6, 2012, Wafer Supply Agreement Amendment No. 4 dated as of March 30, 2014 and Wafer Supply Agreement Amendment No. 5, dated as of April 16, 2015 (collectively, the “Prior Amendments”) by and among (i) Advanced Micro Devices, Inc., a Delaware corporation (“AMD”); (ii) with respect to all of the provisions in the Agreement other than those in Sections 5.5(a), 6.2 and 7.3(a) of the Agreement and the related provisions of the Agreemen
FIRST AMENDMENT TO AMENDED AND RESTATED WAFER SUPPLY AGREEMENT AMENDMENT NO. 7Wafer Supply Agreement • February 3rd, 2022 • Advanced Micro Devices Inc • Semiconductors & related devices
This First Amendment to Amended and Restated Seventh Amendment to the WAFER SUPPLY AGREEMENT (this “Amendment”), dated as of December 23, 2021, amends that certain Wafer Supply Agreement, dated March 2, 2009 (the “Original WSA,” as amended by the Amended and Restated Wafer Supply Agreement Amendment No. 7 and this Amendment, collectively the “Agreement”), by and among (i) Advanced Micro Devices, Inc., a Delaware corporation (“AMD”); (ii) with respect to all of the provisions in the Agreement other than those in Sections 5.5(a), 6.2 and 7.3(a) of the Agreement and the related provisions of the Agreement in connection with sales activities only (though without limiting FoundryCo’s guarantee obligations pursuant to Section 15.7 of the Agreement), GLOBALFOUNDRIES Inc., an exempted company incorporated under the laws of the Cayman Islands (“FoundryCo”), on behalf of itself and its direct and indirect wholly-owned subsidiaries, including all FoundryCo Sales Entities and FoundryCo Manufacturi
AMENDMENT NUMBER FOUR TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • February 5th, 2021 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Four (the "Amendment"), effective as of April 1, 2015 (the "Amendment Effective Date"), amends the Wafer Supply Agreement effective April 1, 2005, as amended by Amendment Number One effective December 19, 2008, Amendment Number Two effective September 13, 2010, and Amendment number Three effective February 1, 2012 (as amended the Agreement''') by and between:
WAFER SUPPLY AGREEMENTWafer Supply Agreement • July 26th, 2005 • Power Integrations Inc • Semiconductors & related devices • California
WHEREAS, POWER INTEGRATIONS is engaged in the design, development, marketing and sale of various integrated circuit products for use in power conversion applications; and
TERMINATION OF WAFER SUPPLY AGREEMENTWafer Supply Agreement • December 4th, 2017
This announcement is made by Comtec Solar Systems Group Limited (the ‘‘Company’’, together with its subsidiaries, the ‘‘Group’’) to keep the shareholders and potential investors of the Company informed of the latest business development of the Group.
AMENDMENT NUMBER FIVE TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • February 5th, 2021 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Five (the "Amendment"), effective as of November 2nd, 2015 (the "Amendment Effective Date"), amends the Wafer Supply Agreement effective April 1, 2005, as amended by Amendment Number One effective December 19, 2008, Amendment Number Two effective September 13, 2010, Amendment number Three effective February 1, 2012, and Amendment number four effective April 1, 2015 (as amended the Agreement''') by and between:
WAFER SUPPLY AGREEMENTWafer Supply Agreement • November 7th, 2023 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number One (the “Amendment”), effective as of July 20, 2005 (“Amendment Date”), amends the Wafer Supply Agreement effective as of May 23, 2003 (the “Agreement”), by and between Power Integrations, Inc. and ZMD Analog Mixed Signal Services GmbH & CoKG.
AMENDMENT NUMBER NINE TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • May 7th, 2020 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Nine (the "Amendment"), effective as of October 1, 2017, (the "Amendment Effective Date"), amends the Wafer Supply Agreement effective April 1, 2005, as amended by Amendment Number One effective December 19, 2008, Amendment Number Two effective September 13, 2010, Amendment number Three effective February 1, 2012, Amendment number Four effective April 1, 2015, Amendment number Five effective November 2, 2015, Amendment number Six effective December 8, 2015, Amendment number Seven effective October 3, 2016, and Amendment number Eight effective November 8, 2016 (as amended the “Agreement''') by and between:
AMENDMENT NUMBER FOURWafer Supply Agreement • February 11th, 2016 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Four (the "Amendment"), effective as of April 1, 2015 (the "Amendment Effective Date"), amends the Wafer Supply Agreement effective April 1, 2005, as amended by Amendment Number One effective December 19, 2008, Amendment Number Two effective September 13, 2010, and Amendment number Three effective February 1, 2012 (as amended the Agreement''') by and between:
Contract Change Notice/Amendment No. 07 to TRW Inc./Sirenza Microdevices Wafer Supply Agreement Agreement No. 1A551Wafer Supply Agreement • February 27th, 2003 • Sirenza Microdevices Inc • Semiconductors & related devices
AMENDMENT NUMBER SIX TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • February 11th, 2016 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Six (the “Amendment") effective as of December 8, 2015 (the “Amendment Effective Date”) amends the Wafer Supply Agreement effective April 1, 2005, as amended by Amendment number one effective December 19, 2008, Amendment number two effective September 13, 2010, Amendment number three effective February 1, 2012, Amendment number four effective April 1, 2015, and Amendment number five effective November 2, 2015 (as amended the “Agreement”) by and between:
AMENDMENT NUMBER THREE TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • July 29th, 2021 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Three (the “Amendment”) is effective as of April 21, 2021 and amends the Wafer Supply Agreement that is effective as of October 1, 2010, as amended by Amendment Number One that is effective as of January 1, 2014, as amended by Amendment Number Two that is effective as of December 1, 2018 (“the AGREEMENT”), and is entered into by and between:
Wafer Supply Agreement between Jiangsu Zhongneng Polysilicon Technology Development Co., Ltd. and Solarcell S. p. A Contract No. [ELC00163] June 1, 2008Wafer Supply Agreement • August 29th, 2008 • GCL Silicon Technology Holdings Inc. • Semiconductors & related devices
This Wafer Supply Agreement (this “Agreement”) is entered into as of June 1, 2008, by and between Jiangsu Zhongneng Polysilicon Technology Development Co. Ltd. ( ), a company limited by shares established in the People’s Republic of China with its principal place of business at 310 Xuzhou Economic Development Zone, North of the National Highway, Xuzhou, Jiangsu Province, People’s Republic of China (the “Seller”), and Solarcell S.p.A., a joint stock company corporation with its principal place of business at via Verdi, 10, Brugherio (Milan), Italy (the “Buyer”). Seller and the Buyer together shall be referred to as the “Parties” and individually as a “Party”.
RENESOLA LTD – “RENESOLA” WAFER SUPPLY AGREEMENTWafer Supply Agreement • October 18th, 2007
ReneSola (AIM:SOLA), a leading manufacturer of solar wafers for the photovoltaic industry, is pleased to announce a contract to supply 510MW of silicon wafers to Suntech Power Holdings Co., Ltd (“Suntech”) over a four-year period beginning in January 2008.
WAFER SUPPLY AGREEMENT AMENDMENT NO. 1Wafer Supply Agreement • October 28th, 2020 • Advanced Micro Devices Inc • Semiconductors & related devices
This First Amendment to the WAFER SUPPLY AGREEMENT (this “Amendment”), dated as of March 29, 2011, amends that certain Wafer Supply Agreement, dated March 2, 2009, (the “Agreement”) by and among (i) Advanced Micro Devices, Inc., a Delaware corporation (“AMD”); (ii) with respect to all of the provisions in the Agreement other than those in Sections 5.5(a), 6.2 and 7.3(a) of the Agreement and the related provisions of the Agreement in connection with sales activities only (though without limiting FoundryCo’s guarantee obligations pursuant to Section 15.7 of the Agreement), GLOBALFOUNDRIES Inc., an exempted company incorporated under the laws of the Cayman Islands (“FoundryCo”), on behalf of itself and its direct and indirect wholly-owned subsidiaries, including all FoundryCo Sales Entities and FoundryCo Manufacturing Entities, as further set forth in the Agreement; (iii) subject to FoundryCo’s guarantee obligations pursuant to Section 15.7 of the Agreement, GLOBALFOUNDRIES U.S. Inc., a D
AMENDMENT ONE TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • February 26th, 2010 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number One (the “Amendment”), effective as of July 20, 2005 (“Amendment Date”), amends the Wafer Supply Agreement effective as of May 23, 2003 (the “Agreement”), by and between Power Integrations, Inc. and ZMD Analog Mixed Signal Services GmbH & CoKG.
DEVELOPMENT ADDENDUM TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • November 1st, 2013 • Power Integrations Inc • Semiconductors & related devices
This development addendum (this “ADDENDUM") supplementing the wafer supply agreement between the Parties effective April 1, 2005 (the “AGREEMENT”) is made and entered into as of September 22, 2013, between:
AMENDMENT NUMBER FIVE TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • February 26th, 2010 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Five (the “Amendment”), effective as of December 1, 2009 (the “Amendment Effective Date”), amends the Wafer Supply Agreement effective as of May 23, 2003 (as previously amended) (the “Agreement”), by and between X-FAB Dresden GmbH & Co. KG (successor in interest to ZMD Analog Mixed Signal Services GmbH & CoKG) a German corporation (the “Company”) and Power Integrations International, Ltd. (“PI”) a Cayman Islands corporation having its principal place of business at 4th Floor, Century Yard, Cricket Square, Elgin Avenue, P.O. Box 32322, Grand Cayman KY 1-1209. Unless specifically designated otherwise, capitalized terms used herein shall have the same meanings given them in the Agreement.
AMENDMENT NUMBER FIVE TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • February 11th, 2016 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Five (the "Amendment"), effective as of November 2nd, 2015 (the "Amendment Effective Date"), amends the Wafer Supply Agreement effective April 1, 2005, as amended by Amendment Number One effective December 19, 2008, Amendment Number Two effective September 13, 2010, Amendment number Three effective February 1, 2012, and Amendment number four effective April 1, 2015 (as amended the Agreement''') by and between:
AMENDMENT NUMBER THREE TO AMENDED AND RESTATED WAFER SUPPLY AGREEMENTWafer Supply Agreement • August 8th, 2008 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Three (the “Amendment ”), effective as of June 9, 2008 (the “Amendment Effective Date”), amends the Amended and Restated Wafer Supply Agreement effective as of April 1, 2003 (as further amended by Amendment Number One, effective August 11, 2004 and Amendment Number Two, effective April 1, 2008) (the “Agreement”), by and between OKI Electric Industry Co., Ltd. (“OKI ELECTRIC” or “OKI”), a Japanese corporation having its registered head office at 7-12, Toranomon 1-chome, Minato-ku, Tokyo 105-8460, Japan, and Power Integrations International, Ltd. (“PI”) a Cayman Islands corporation having its principal place of business at 4th Floor, Century Yard, Cricket Square, Elgin Avenue, P.O. Box 32322, Grand Cayman KY1-1209. Unless specifically designated otherwise, capitalized terms used herein shall have the same meanings given them in the Agreement.
ContractWafer Supply Agreement • August 7th, 2003 • Power Integrations Inc • Semiconductors & related devices • California
[Certain information in this document has been omitted and filed separately with the Securities and Exchange Commission. Confidential treatment has been requested with respect to the omitted portions. The omitted portions are indicated by “****.”]
AMENDMENT NUMBER SEVEN TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • February 8th, 2017 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Seven (the “Amendment") effective as of Oct. 3rd, 2016 (the “Amendment Effective Date”) amends the Wafer Supply Agreement effective April 1, 2005, as amended by Amendment number one effective December 19, 2008, Amendment number two effective September 13, 2010, Amendment number three effective February 1, 2012, Amendment number four effective April 1, 2015, Amendment number five effective November 2, 2015 and Amendment number six effective December 8, 2015 (as amended the “Agreement”) by and between:
AMENDMENT NUMBER THIRTEEN TO AMENDED AND RESTATEDWafer Supply Agreement • April 28th, 2022 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Thirteen (the "Amendment"), is effective as of February 17, 2022 (the "Amendment Effective Date"), and amends the Amended and Restated Wafer Supply Agreement that is effective as of April 1, 2003, as further amended by Amendment Number One that is effective as of August 11, 2004, Amendment Number Two, that is effective as of April 1, 2008, Amendment Number Three, that is effective as of June 9, 2008, Amendment Number Four, that is effective as of June 13, 2008, Amendment Number Five that is effective as of November 14, 2008, Amendment Number Six that is effective as of November 1, 2015, Amendment Number Seven that is effective as of August 8, 2016, Amendment Number Eight that is effective as of July 26, 2017, Amendment Number Nine that is effective as of February 6, 2019, amendment Number 10 that is effective as of December 16, 2019, Amendment Number Eleven that is effective as of December 20, 2019, and Amendment Number Twelve that is effective as of September 17,
WAFER SUPPLY AGREEMENT AMENDMENT NO. 6Wafer Supply Agreement • October 28th, 2020 • Advanced Micro Devices Inc • Semiconductors & related devices
This Sixth Amendment to the WAFER SUPPLY AGREEMENT (this “Sixth Amendment”), dated as of August 30, 2016, amends that certain Wafer Supply Agreement, dated March 2, 2009 (the “Original WSA,” as amended by this Sixth Amendment, the “Agreement”), as previously amended by Wafer Supply Agreement Amendment No. 1 dated as of April 2, 2011, Wafer Supply Agreement Amendment No. 2 dated as of March 4, 2012, Wafer Supply Agreement Amendment No. 3 dated as of December 6, 2012, Wafer Supply Agreement Amendment No. 4 dated as of March 30, 2014 and Wafer Supply Agreement Amendment No. 5, dated as of April 16, 2015 (collectively, the “Prior Amendments”) by and among (i) Advanced Micro Devices, Inc., a Delaware corporation (“AMD”); (ii) with respect to all of the provisions in the Agreement other than those in Sections 5.5(a), 6.2 and 7.3(a) of the Agreement and the related provisions of the Agreement in connection with sales activities only (though without limiting FoundryCo’s guarantee obligations p
