AMONG THE DII GROUP, INC. AND THE SUBSIDIARY BORROWERS FROM TIME TO TIME PARTIES HERETO,Credit Agreement • March 19th, 1999 • Dii Group Inc • Electronic components & accessories • New York
RECITALSLoan Agreement • November 12th, 1997 • Dii Group Inc • Electronic components & accessories • Colorado
and -Dii Group Inc • September 8th, 1998 • Electronic components & accessories • Hong Kong
RECITALSEmployment Agreement • May 12th, 1998 • Dii Group Inc • Electronic components & accessories • Colorado
Underwriting AgreementDii Group Inc • September 24th, 1999 • Electronic components & accessories • New York
RECITALSEmployment Agreement • March 19th, 1999 • Dii Group Inc • Electronic components & accessories • Colorado
2- 3 (ii) If for any reason other than Executive's voluntary resignation or termination pursuant to Sections 7(a), (b) or (c) hereof, Executive does not continue to be employed by the Company, Executive shall continue to receive an amount equal to his...Employment Agreement • May 13th, 1997 • Dii Group Inc • Electronic components & accessories • Colorado
ASSIGNMENT AND ASSUMPTION AGREEMENT dated as of August 18, 1997 (this "Agreement"), between Multilayer Tek L.P. ("Buyer"), and INTERNATIONAL BUSINESS MACHINES CORPORATION, a New York corporation ("Seller").Assumption Agreement • September 2nd, 1997 • Dii Group Inc • Electronic components & accessories • New York
AMONG MULTILAYER TECHNOLOGY GMBH & CO. KG, AS BORROWER,Credit Agreement • March 19th, 1999 • Dii Group Inc • Electronic components & accessories • New York
Technology License Agreement between Hewlett-Packard GmbH and The DII Group, Inc.Technology License Agreement • November 16th, 1998 • Dii Group Inc • Electronic components & accessories
THE DII GROUP, INC.Dii Group Inc • November 12th, 1997 • Electronic components & accessories • New York
RECITALSEmployment Agreement • May 17th, 1999 • Dii Group Inc • Electronic components & accessories • Colorado
RECITALSEmployment Agreement • May 17th, 1999 • Dii Group Inc • Electronic components & accessories
RECITALSConfidential Disclosure Agreement • November 16th, 1998 • Dii Group Inc • Electronic components & accessories
EXHIBIT 10.3 SENIOR EXECUTIVE SEVERANCE AGREEMENT AGREEMENT made as of the first day of January 1997 by and between THE DII GROUP, INC., a Delaware corporation (the "Corporation"), and Steven C. Schlepp (the "Executive"). W I T N E S S E T H WHEREAS,...Senior Executive Severance Agreement • May 17th, 1999 • Dii Group Inc • Electronic components & accessories • Delaware
1 EXHIBIT 4.3 THE DII GROUP, INC. 8.50% Senior Subordinated Notes Due 2007 REGISTRATION RIGHTS AGREEMENTDii Group Inc • November 12th, 1997 • Electronic components & accessories • New York
RECITALSEmployment and Deferred Compensation Agreement • March 19th, 1999 • Dii Group Inc • Electronic components & accessories • Colorado
RECITALSEmployment Agreement • November 12th, 1997 • Dii Group Inc • Electronic components & accessories
RECITALSEmployment Agreement • November 12th, 1997 • Dii Group Inc • Electronic components & accessories
Confidential treatment has been requested as to portions of this exhibit **** Indicates portions of text that have been redacted and filed separately with the Securities and Exchange Commission. MASTER ASSET PURCHASE AGREEMENT by and among H E W L E T...Master Asset Purchase Agreement • November 16th, 1998 • Dii Group Inc • Electronic components & accessories
INDENTUREIndenture • November 12th, 1997 • Dii Group Inc • Electronic components & accessories • New York
1 EXHIBIT 10.2 MASTER MANUFACTURING AGREEMENT This Master Agreement ("Agreement") is effective as of 2/17/97 ("the Effective Date") between Hewlett Packard Company ("HP") and Dovatron International ("Dovatron"). The term "Agreement" includes all...Master Manufacturing Agreement • May 13th, 1997 • Dii Group Inc • Electronic components & accessories • California
RECITALSTransition Services • November 16th, 1998 • Dii Group Inc • Electronic components & accessories
RECITALS:Division Purchase Agreement • November 16th, 1998 • Dii Group Inc • Electronic components & accessories • California
1 EXHIBIT 2.4 PROJECT OPERATIONS AGREEMENTProject Operations Agreement • September 2nd, 1997 • Dii Group Inc • Electronic components & accessories • New York
STATE OF TEXAS ) ) COUNTY OF )Dii Group Inc • September 2nd, 1997 • Electronic components & accessories
1 EXHIBIT 10.4 THE DII GROUP, INC. PERFORMANCE SHARE AGREEMENT PURSUANT TO THE 1994 STOCK INCENTIVE PLAN This Performance Share Agreement is made and entered into as of the Date of Award specified herein, by and between THE DII GROUP, INC., a Delaware...Performance Share Agreement • May 13th, 1997 • Dii Group Inc • Electronic components & accessories • Delaware
BILL OF SALEDii Group Inc • September 2nd, 1997 • Electronic components & accessories
betweenDii Group Inc • November 16th, 1998 • Electronic components & accessories
ENGLISH TRANSLATION OF GERMAN DOCUMENT. GERMAN VERSION IS CONTROLING] REAL ESTATE PURCHASE AND SALE AGREEMENT Hewlett-Packard GmbH & Co. Immobilien KG Herrenberger Strabe 130 71034 Boeblingen (the Seller) - referred to as "HP" in the following -Dii Group Inc • November 16th, 1998 • Electronic components & accessories
