POWER INTEGRATIONS, INC. EXECUTIVE OFFICER BENEFITS AGREEMENTExecutive Officer Benefits Agreement • July 29th, 2021 • Power Integrations Inc • Semiconductors & related devices • California
This Executive Officer Benefits Agreement (the “Agreement”) is made and entered into as of June 14, 2021 (the “Effective Date”), by and between Power Integrations, Inc., a Delaware corporation, (the “Company”) and Yang Chiah Yee (“Executive”).
AMENDMENT NUMBER THREE TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • July 29th, 2021 • Power Integrations Inc • Semiconductors & related devices
This Amendment Number Three (the “Amendment”) is effective as of April 21, 2021 and amends the Wafer Supply Agreement that is effective as of October 1, 2010, as amended by Amendment Number One that is effective as of January 1, 2014, as amended by Amendment Number Two that is effective as of December 1, 2018 (“the AGREEMENT”), and is entered into by and between:
SECOND AMENDMENT TO CREDIT AGREEMENTCredit Agreement • July 29th, 2021 • Power Integrations Inc • Semiconductors & related devices
THIS AMENDMENT TO CREDIT AGREEMENT (this "Amendment") dated June 7, 2021, is entered into by and between POWER INTEGRATIONS, INC., a Delaware corporation ("Borrower"), and WELLS FARGO BANK, NATIONAL ASSOCIATION ("Bank").
