0000950134-07-004387 Sample Contracts

U.S. $1,000,000,000 CREDIT AGREEMENT Dated as of January 26, 2007 Among APPLIED MATERIALS, INC. as Borrower and THE INITIAL LENDERS NAMED HEREIN as Initial Lenders CITICORP USA, INC. as Administrative Agent THE BANK OF TOKYO-MITSUBISHI UFJ, LTD.,...

Credit Agreement • February 28th, 2007 • Applied Materials Inc /De • Semiconductors & related devices • New York

• Contract Type
  Credit Agreement
• Filed
  February 28th, 2007
• Company
  Applied Materials Inc /De
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

APPLIED MATERIALS, INC., a Delaware corporation (the “Borrower”), the banks, financial institutions and other institutional lenders (the “Initial Lenders”) listed on the signature pages hereof, and CITICORP USA, INC. (“CUSA”), as agent (the “Agent”) for the Lenders (as hereinafter defined), agree as follows:

SEPARATION AGREEMENT AND RELEASE

Separation Agreement • February 28th, 2007 • Applied Materials Inc /De • Semiconductors & related devices • California

• Contract Type
  Separation Agreement
• Filed
  February 28th, 2007
• Company
  Applied Materials Inc /De
• Industry
  Semiconductors & related devices
• Jurisdiction
  California

This Separation Agreement and Release (“Agreement”) is made by and between Nancy H. Handel (“Employee”) and Applied Materials, Inc. (the “Company”) (collectively referred to as the “Parties” or individually referred to as a “Party”).