CALIFORNIA MICRO DEVICES CORPORATION STOCK AND WARRANT PURCHASE AGREEMENT November 22, 2002Stock and Warrant Purchase Agreement • February 14th, 2003 • California Micro Devices Corp • Electronic components & accessories • California
This Stock and Warrant Purchase Agreement (this “Agreement”) is made as of the 22nd day of November, 2002 (the “Effective Date”), by and among California Micro Devices Corporation, a California corporation (the “Company”), and each of the persons listed on the signature pages hereto (each of whom is herein referred to individually as an “Investor” and collectively as the “Investors”). The parties hereto agree as follows:
CONFIDENTIAL TREATMENT REQUESTED LOAN DEFAULT WAIVER AGREEMENTLoan Default Waiver Agreement • February 14th, 2003 • California Micro Devices Corp • Electronic components & accessories
THIS LOAN DEFAULT WAIVER AGREEMENT is entered into as of October 21, 2002, by and between CALIFORNIA MICRO DEVICES CORPORATION, a California corporation (the “Borrower”) and SILICON VALLEY BANK (“Bank”). Borrower and Bank are parties to a Loan and Security Agreement, dated June 17, 2002, as amended or modified from time to time, (the “Loan Agreement”). Defined terms used but not otherwise defined herein shall have the same meanings as set forth in the Loan Agreement.
CONFIDENTIAL TREATMENT REQUESTED LICENSE AGREEMENTLicense Agreement • February 14th, 2003 • California Micro Devices Corp • Electronic components & accessories
FCT has developed Confidential Information, trade secrets, patents and know-how regarding Ultra CSP™ wafer bumping in the manufacture of flip chip integrated circuits; and certain Confidential Information, trade secrets, patents and know-how regarding the technology of redistributing bond pads on integrated circuits using a Redistribution Layer (RDL) to facilitate wafer bumping in the manufacture of flip chip integrated circuits.
October 23, 2001Letter Agreement • February 14th, 2003 • California Micro Devices Corp • Electronic components & accessories • New York
This letter agreement (this “Agreement”) confirms the understanding and agreement between Needham & Company, Inc. (the “Placement Agent”) and California Micro Devices Corporation (the “Company”) as follows:
