MTV LEASE AGREEMENTLease Agreement • April 28th, 2006 • Micron Technology Inc • Semiconductors & related devices • Delaware
This MTV Lease Agreement (this “Lease”) is made as of the 6th day of January, 2006, by and between MICRON TECHNOLOGY, INC., a Delaware corporation (hereinafter referred to as the “Landlord”), and IM FLASH TECHNOLOGIES, LLC, a Delaware limited liability company (hereinafter referred to as “Tenant”).
BOISE SUPPLY AGREEMENTBoise Supply Agreement • April 28th, 2006 • Micron Technology Inc • Semiconductors & related devices • Delaware
This BOISE SUPPLY AGREEMENT (the “Agreement”), is made and entered into as of this 6th day of January, 2006 (the “Effective Date”), by and between IM Flash Technologies, LLC, a Delaware limited liability company (the “Joint Venture Company”) and Micron Technology, Inc., a Delaware corporation (“Micron”).
SUPPLY AGREEMENTSupply Agreement • April 28th, 2006 • Micron Technology Inc • Semiconductors & related devices • Delaware
This SUPPLY AGREEMENT (the “Agreement”), is made and entered into as of this 6th day of January, 2006 (the “Effective Date”), by and between Micron Technology, Inc., a Delaware corporation (“Micron”), and IM Flash Technologies, LLC, a Delaware limited liability company (the “Joint Venture Company”).
MANUFACTURING SERVICES AGREEMENTManufacturing Services Agreement • April 28th, 2006 • Micron Technology Inc • Semiconductors & related devices • Delaware
This MANUFACTURING SERVICES AGREEMENT (the “Agreement”), is made and entered into as of this 6th day of January, 2006 (the “Effective Date”), by and between Micron Technology, Inc., a Delaware corporation (“Micron”), and IM Flash Technologies, LLC, a Delaware limited liability company (“Joint Venture Company”).
SUPPLY AGREEMENTSupply Agreement • April 28th, 2006 • Micron Technology Inc • Semiconductors & related devices • Delaware
This SUPPLY AGREEMENT (the “Agreement”), is made and entered into as of this 6th day of January, 2006 (the “Effective Date”), by and between Intel Corporation, a Delaware corporation (“Intel”), and IM Flash Technologies, LLC, a Delaware limited liability company (the “Joint Venture Company”).
MASTER AGREEMENT BY AND BETWEEN MICRON TECHNOLOGY, INC. AND INTEL CORPORATION NOVEMBER 18, 2005Master Agreement • April 28th, 2006 • Micron Technology Inc • Semiconductors & related devices • Delaware
This MASTER AGREEMENT (together with the Appendix hereto, this “Agreement”), dated as of the 18th day of November, 2005, is entered into by and between Intel Corporation, a Delaware corporation (“Intel”), and Micron Technology, Inc., a Delaware corporation (“Micron”).
PRODUCT DESIGNS ASSIGNMENT AGREEMENTProduct Designs Assignment Agreement • April 28th, 2006 • Micron Technology Inc • Semiconductors & related devices • Delaware
This PRODUCT DESIGNS ASSIGNMENT AGREEMENT (“Agreement”) is made and entered into as of this 6th day of January, 2006 (“Effective Date”), by and between Intel Corporation, a Delaware corporation (“Intel”), and Micron Technology, Inc., a Delaware corporation (“Micron”). (Micron and Intel are referred to in this Agreement individually as a “Party” and collectively, as the “Parties.”)
NAND Flash Supply Agreement Between Micron and AppleNand Flash Supply Agreement • April 28th, 2006 • Micron Technology Inc • Semiconductors & related devices • California
This NAND Flash Supply Agreement (the “Agreement”) is entered into by and between Apple, a California corporation doing business at 1 Infinite Loop, Cupertino, California (“Apple”), and Micron Technology, Inc., a Delaware corporation, doing business at 8000 S. Federal Way, P.O. Box 6, Boise, Idaho 83707 (“Micron”) as of the Effective Date (as defined below). Apple and Micron are sometimes individually referred to as a “Party” and collectively as the “Parties”.
