SHARE PURCHASE AGREEMENTShare Purchase Agreement • April 28th, 2015 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
Contract Type FiledApril 28th, 2015 Company Industry JurisdictionSHARE PURCHASE AGREEMENT (the “Agreement”), dated as of 12 February 2015, by and among Semiconductor Manufacturing International Corporation, a company established under the laws of Cayman Islands (the “Company”), and China Integrated Circuit Industry Investment Fund Co., Ltd. (国家集成电路产业投资基金股份有限公司), a company established under the laws of the People’s Republic of China (the “Buyer”).
Dated 4 June 2014 (1) SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and (2) DATANG HOLDINGS (HONGKONG) INVESTMENT COMPANY LIMITED and (3) DEUTSCHE BANK AG, HONG KONG BRANCH and (4) J.P. MORGAN SECURITIES (ASIA PACIFIC) LIMITED PLACING AND...Placing and Subscription Agreement • April 28th, 2015 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
Contract Type FiledApril 28th, 2015 Company Industry Jurisdiction
Dated 4 June 2014 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and DEUTSCHE BANK AG, HONG KONG BRANCH and J.P. MORGAN SECURITIES PLC SUBSCRIPTION AGREEMENT relating to US$95,000,000 Zero Coupon Convertible Bonds due 2018 convertible into...Subscription Agreement • April 28th, 2015 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
Contract Type FiledApril 28th, 2015 Company Industry
Dated 25 September 2014 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and DEUTSCHE BANK AG, SINGAPORE BRANCH and J.P. MORGAN SECURITIES PLC SUBSCRIPTION AGREEMENT relating to US$500,000,000 4.125 per cent. Bonds due 2019Subscription Agreement • April 28th, 2015 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
Contract Type FiledApril 28th, 2015 Company IndustryThe Issuer and the Managers wish to record the arrangements agreed between them in relation to an issue of US$500,000,000 4.125 per cent. Bonds due 2019 (the “Bonds”). The Bonds will be in registered form in denominations of U.S.$200,000 and integral multiples of U.S.$1,000 in excess thereof. The Bonds will only be offered and sold outside the United States (as defined below) in reliance on Regulation S (“Regulation S”) under the United States Securities Act of 1933 (the “Securities Act”) and in the United States to qualified institutional buyers (as defined in the Securities Act) in reliance on Rule 144A (“Rule 144A”) under the Securities Act. The Bonds will be represented by separate global certificates (the “Rule 144A Global Bond Certificate” and the “Regulation S Global Bond Certificate” and, together, the “Global Bond Certificates”). The Rule 144A Global Bond Certificate will represent Bonds which are offered and sold in the United States in reliance on Rule 144A and are “restrict