SUPPLEMENTAL SUBSIDIARY GUARANTEE AGREEMENT with respect to the of STATS CHIPPAC LTD. Dated as of September 18, 2007 GUARANTORS STATS CHIPPAC, INC. STATS HOLDINGS LIMITED STATS CHIPPAC TEST SERVICES, INC. STATS CHIPPAC (BARBADOS) LTD. CHIPPAC...Supplemental Subsidiary Guarantee Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices • New York
SUPPLEMENTAL SUBSIDIARY GUARANTEE AGREEMENT dated as of September 18, 2007 (this “Supplemental Agreement”) made among STATS ChipPAC (Thailand) Limited, a Thailand corporation (the “New Guarantor”), each other then existing Guarantor under the Indenture and Original Agreements referred to below (each, a “Guarantor” and collectively, the “Guarantors” and which shall, upon due execution and delivery of this Supplemental Agreement, include the New Guarantor), STATS ChipPAC Ltd., a corporation organized under the laws of the Republic of Singapore, as issuer (the “Company”), and the Trustee (as defined below).
ASSET PURCHASE AGREEMENT Dated as of July 25, 2007 Among STATS CHIPPAC (THAILAND) LIMITED. and STATS CHIPPAC LTD and LSI (THAI) LTD. And LSI CORPORATIONAsset Purchase Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices
ASSET PURCHASE AGREEMENT, dated as of July 25, 2007 (this “Agreement”) among, STATS CHIPPAC (THAILAND) LIMITED. a corporation organized under the laws of the Kingdom of Thailand (“Buyer”), STATS CHIPPAC LTD, a corporation organized under the laws of Singapore (“Buyer Guarantor”), LSI (THAI) LTD., a corporation organized under the laws of the Kingdom of Thailand (“Seller”) and LSI CORPORATION, a corporation organized under the laws of Delaware, USA (“Seller Guarantor”).
Dated this 21st day of May 2007 Between STATS ChipPAC Malaysia Sdn Bhd as vendor And Ningbo Mingxin Microelectronics Co. Ltd. as purchaser And Daheng New Epoch Technology, Inc. as guarantor for Ningbo Mingxin Microelectronics Co. Ltd. ASSETS SALE AND...Assets Sale and Purchase Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices
SECOND AMENDMENT TO IMMUNITY AGREEMENTImmunity Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices
Whereas Motorola Inc., (“MOTOROLA”) and ST Assembly Test Services, Ltd. (“STATS”) entered into an Immunity Agreement on October 18, 1996 involving BGA packages (“IMMUNITY AGREEMENT”);
AGREEMENT FOR THE SALE AND PURCHASE OF ASSETSAgreement for the Sale and Purchase of Assets • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices
AMENDMENT NO. 1 TO ASSET PURCHASE AGREEMENT among STATS CHIPPAC (THAILAND) LIMITED. and STATS CHIPPAC LTD and LSI (THAI) LTD. And LSI CORPORATION DATED 2 OCTOBER 2007Asset Purchase Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices
