ANDIndenture • March 31st, 2003 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • New York
DATED AS OF NOVEMBER 18, 2004 BY AND AMONGRegistration Rights Agreement • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
Exhibit 4.41 ================================================================== ============== STATS CHIPPAC LTD. (a corporation organized under the laws of the Republic of Singapore) Senior Notes due 2011 PURCHASE AGREEMENT Dated: November 5, 2004...Purchase Agreement • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
1 EXHIBIT 10.2 THIS AGREEMENT is made the 5th day of June One Thousand Nine Hundred and Ninety Eight (1998) Between: ST ASSEMBLY TEST SERVICES LTD a company incorporated in Singapore and having its registered office at 5 Yishun Street 23 Singapore...Loan Agreement • January 3rd, 2000 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
RECITALSPledge Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
andSecond Supplemental Indenture • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
BETWEENLoan Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
1 EXHIBIT 10.4 AN AGREEMENT made the 18th day of November 1996 BETWEEN HOUSING & DEVELOP- MENT BOARD, a Body Corporate incorporated under the Housing & Development Act and having its office at Bukit Merah Centre, 3451 Jalan Bukit Merah, Singapore...Licensing Agreement • January 3rd, 2000 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
andThird Supplemental Indenture • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
1 EXHIBIT 2.2 DEPOSIT AGREEMENTDeposit Agreement • March 30th, 2001 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • New York
ANDIndenture • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • New York
1 EXHIBIT 1.1 ST Assembly Test Services Ltd 102,000,000 Ordinary Shares */ (S$0.25 par value) directly or in the form of American Depositary Shares Each American Depositary Share representing the right to receive ten Ordinary Shares U.S. Underwriting...u.s. Underwriting Agreement • January 25th, 2000 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • New York
RECITALSShare Pledge Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
1 Exhibit 1.2 ST Assembly Test Services Ltd 51,000,000 Ordinary Shares */ (S$0.25 par value) directly or in the form of American Depositary Shares Each American Depositary Share representing the right to receive ten Ordinary Shares International...International Underwriting Agreement • January 25th, 2000 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • New York
TRUST DEED RELATING TO ST ASSEMBLY TEST SERVICES LTD S$500,000,000 MULTICURRENCY MEDIUM TERM NOTE PROGRAMME [ALLEN & GLEDHILL LOGO] 36 ROBINSON ROAD #18-01 CITY HOUSE SINGAPORE 068877Trust Deed • February 28th, 2002 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
16 JANUARY 2004Securities Pledge Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • London
ARTICLE 2 NOTE GUARANTEESSubsidiary Guarantee Agreement • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
amongAgreement and Plan of Merger and Reorganization • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • Delaware
EXHIBIT 4.13 THIS SECURITY IS A GLOBAL NOTE WITHIN THE MEANING OF THE INDENTURE HEREINAFTER REFERRED TO AND IS REGISTERED IN THE NAME OF A DEPOSITARY OR A NOMINEE THEREOF, WHICH MAY BE TREATED BY THE COMPANY, THE TRUSTEE OR ANY AGENT THEREOF AS OWNER...Indenture • March 31st, 2003 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
EXHIBIT 4.12 PAGES WHERE CONFIDENTIAL TREATMENT HAS BEEN REQUESTED ARE STAMPED 'CONFIDENTIAL TREATMENT REQUESTED AND THE REDACTED MATERIAL HAS BEEN SEPARATELY FILED WITH THE COMMISSION' AND THE CONFIDENTIAL SECTION HAS BEEN MARKED IN THE MARGIN WITH A...Immunity Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • Illinois
RELATING TO ST ASSEMBLY TEST SERVICES LTD S$500,000,000 MULTICURRENCY MEDIUM TERM NOTE PROGRAMME 36 ROBINSON ROAD #18-01 [ALLEN & GLEDHILL LOGO] CITY HOUSE SINGAPORE 068877 C O N T E N T SAgency Agreement • February 28th, 2002 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
RELATING TO ST ASSEMBLY TEST SERVICES LTD S$500,000,000 MULTICURRENCY MEDIUM TERM NOTE PROGRAMME [ALLEN & GLEDHILL LOGO] 36, ROBINSON ROAD, #18-01, CITY HOUSE, SINGAPORE 068877. C O N T E N T SProgramme Agreement • February 28th, 2002 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
MANAGEMENT AND UNDERWRITING AGREEMENT RELATING TO THE SINGAPORE RETAIL OFFERING ALLEN & GLEDHILL, 36, ROBINSON ROAD, #18-01, CITY HOUSE, SINGAPORE 068877.Management and Underwriting Agreement • January 25th, 2000 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
1 EXHIBIT 10.1 ST GROUP MANAGEMENT & SUPPORT SERVICES AGREEMENT THIS AGREEMENT is made the 27th day of December 1999 BETWEEN: (1) SINGAPORE TECHNOLOGIES PTE LTD, a company incorporated in Singapore and having its registered office at 51 Cuppage Road,...Management & Support Services Agreement • January 3rd, 2000 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
GLOBAL NOTEGlobal Note • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
THIS SECURITY IS A GLOBAL NOTE WITHIN THE MEANING OF THE INDENTURE HEREINAFTER REFERRED TO AND IS REGISTERED IN THE NAME OF THE BANK OF NEW YORK DEPOSITARY (NOMINEES) LIMITED AS NOMINEE FOR THE COMMON DEPOSITARY (THE "COMMON DEPOSITARY") FOR EUROCLEAR BANK S.A./N.V. ("EUROCLEAR") AND CLEARSTREAM BANKING, SOCIETE ANONYME ("CLEARSTREAM") OR A NOMINEE THEREOF, WHICH MAY BE TREATED BY THE COMPANY, THE TRUSTEE OR ANY AGENT THEREOF AS OWNER AND HOLDER OF THIS SECURITY FOR ALL PURPOSES. THIS GLOBAL NOTE MAY NOT BE EXCHANGED, IN WHOLE OR IN PART, FOR A SECURITY REGISTERED, AND NO TRANSFER OF THIS GLOBAL NOTE IN WHOLE OR IN PART MAY BE REGISTERED, IN THE NAME OF ANY PERSON OTHER THAN THE BANK OF NEW YORK DEPOSITORY (NOMINEES) LIMITED OR A NOMINEE THEREOF, EXCEPT IN THE LIMITED CIRCUMSTANCES SET FORTH IN THE INDENTURE.
EMPLOYMENT AGREEMENTEmployment Agreement • April 6th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
THIS EMPLOYMENT AGREEMENT is dated as of this 26th day of February, 2004 by and among ST Assembly Test Services Ltd, a Singapore public company limited by shares (the “Company”), ChipPAC, Inc., a Delaware corporation (“ChipPAC”), Dennis Daniels, an individual (the “Employee”).
ARTICLE 2 NOTE GUARANTEESSupplemental Subsidiary Guarantee Agreement • February 28th, 2006 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
CHIPPAC, INC. RETENTION AND SEVERANCE AGREEMENTRetention and Severance Agreement • June 10th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
In recognition of your committed efforts as an employee of ChipPAC, Inc. (the “Company”), we are offering you the opportunity to receive a special retention payment in the amount set forth below (the “Retention Payment”) and a special severance payment in the amount set forth below (the “Severance Payment,” together with other benefits, the “Severance Benefits”) in connection with the closing (the “Closing”) of the transactions contemplated by the Agreement and Plan of Merger and Reorganization among ST Assembly Test Services Ltd, Camelot Merger, Inc. and ChipPAC, Inc. dated as of February 10, 2004. The Retention Benefits and Severance Benefits both will be fully subject to the terms of the ChipPAC, Inc. Employee Retention and Severance Plan (the “Plan”). Capitalized terms used and not otherwise defined herein have the meanings set forth in the Plan.
SUPPLEMENTAL SUBSIDIARY GUARANTEE AGREEMENT with respect to the of STATS CHIPPAC LTD. Dated as of September 18, 2007 GUARANTORS STATS CHIPPAC, INC. STATS HOLDINGS LIMITED STATS CHIPPAC TEST SERVICES, INC. STATS CHIPPAC (BARBADOS) LTD. CHIPPAC...Supplemental Subsidiary Guarantee Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices • New York
SUPPLEMENTAL SUBSIDIARY GUARANTEE AGREEMENT dated as of September 18, 2007 (this “Supplemental Agreement”) made among STATS ChipPAC (Thailand) Limited, a Thailand corporation (the “New Guarantor”), each other then existing Guarantor under the Indenture and Original Agreements referred to below (each, a “Guarantor” and collectively, the “Guarantors” and which shall, upon due execution and delivery of this Supplemental Agreement, include the New Guarantor), STATS ChipPAC Ltd., a corporation organized under the laws of the Republic of Singapore, as issuer (the “Company”), and the Trustee (as defined below).
RECITALSYangdo Tambo Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Dated this 22nd day of June 2006 Between WUXI CR MICRO-ASSEMBLY TECH. LTD. as the manufacturer And CHINA RESOURCES LOGIC LIMITED And STATS CHIPPAC (BVI) LIMITED as the manufacturer’s representative And STATS CHIPPAC LTD. MANUFACTURER’S REPRESENTATIVE...Manufacturer’s Representative Agreement • March 12th, 2007 • Stats Chippac Ltd. • Semiconductors & related devices
ASSET PURCHASE AGREEMENT Dated as of July 25, 2007 Among STATS CHIPPAC (THAILAND) LIMITED. and STATS CHIPPAC LTD and LSI (THAI) LTD. And LSI CORPORATIONAsset Purchase Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices
ASSET PURCHASE AGREEMENT, dated as of July 25, 2007 (this “Agreement”) among, STATS CHIPPAC (THAILAND) LIMITED. a corporation organized under the laws of the Kingdom of Thailand (“Buyer”), STATS CHIPPAC LTD, a corporation organized under the laws of Singapore (“Buyer Guarantor”), LSI (THAI) LTD., a corporation organized under the laws of the Kingdom of Thailand (“Seller”) and LSI CORPORATION, a corporation organized under the laws of Delaware, USA (“Seller Guarantor”).
Dated this 21st day of May 2007 Between STATS ChipPAC Malaysia Sdn Bhd as vendor And Ningbo Mingxin Microelectronics Co. Ltd. as purchaser And Daheng New Epoch Technology, Inc. as guarantor for Ningbo Mingxin Microelectronics Co. Ltd. ASSETS SALE AND...Assets Sale and Purchase Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices
REGISTRATION RIGHTS AGREEMENT Dated as of July 19, 2005 by and among STATS ChipPac Ltd., the Guarantor Signatories Hereto and Credit Suisse First Boston (Singapore) Limited Deutsche Bank AG, Singapore BranchRegistration Rights Agreement • August 25th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
This Registration Rights Agreement (this “Agreement”) is made and entered into as of July 19, 2005, by and among STATS ChipPac Ltd., a corporation organized under the laws of the Republic of Singapore (the “Company”) and the subsidiaries of the Company listed on the signature pages hereto (the “Guarantors”), and Credit Suisse First Boston (Singapore) Limited (“CSFB”) and Deutsche Bank AG, Singapore Branch (“Deutsche Bank”) as joint lead managers and joint book-running managers, (collectively the “Joint Lead Managers”) and each of the other Initial Purchasers (as defined herein) named in Schedule A of the Purchase Agreement (as defined below) (collectively with the Joint Lead Managers, the “Initial Purchasers”, which term shall also include any initial purchaser substituted as hereinafter provided in Section 11 of the Purchase Agreement (as defined herein)), for whom CSFB and Deutsche Bank are acting as representatives (in such capacity, the “Representatives”), with respect to the issua
Exhibit 4.4 STATS CHIPPAC LTD. SUBSTITUTE EQUITY INCENTIVE PLAN 1. Purposes of the Plan. Pursuant to that certain Agreement and Plan of Merger and Reorganization, dated as of February 10, 2004 (the "Merger Agreement"), among ST Assembly Test Services...Substitute Equity Incentive Plan • August 25th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
