POWER INTEGRATIONS, INC. EXECUTIVE OFFICER BENEFITS AGREEMENTExecutive Officer Benefits Agreement • May 6th, 2009 • Power Integrations Inc • Semiconductors & related devices • California
Contract Type FiledMay 6th, 2009 Company Industry JurisdictionTHIS EXECUTIVE OFFICER BENEFITS AGREEMENT (the “Agreement”) is made and entered into as of November 5, 2008 (the “Effective Date”), by and between POWER INTEGRATIONS, INC., a Delaware corporation, (the “Company”) and BILL ROESCHLEIN (“Executive”).
AMENDMENT NUMBER ONE TO WAFER SUPPLY AGREEMENTWafer Supply Agreement • May 6th, 2009 • Power Integrations Inc • Semiconductors & related devices
Contract Type FiledMay 6th, 2009 Company IndustryThis Amendment Number One (the “Amendment”), effective as of December 19, 2008 (the “Amendment Effective Date”), amends the Wafer Supply Agreement effective April 1, 2005 (the “Agreement”) by and between:
POWER INTEGRATIONS, INC. NONSTATUTORY STOCK OPTION AGREEMENT FOR OUTSIDE DIRECTORSNonstatutory Stock Option Agreement • May 6th, 2009 • Power Integrations Inc • Semiconductors & related devices • Delaware
Contract Type FiledMay 6th, 2009 Company Industry JurisdictionTHIS NONSTATUTORY STOCK OPTION AGREEMENT FOR OUTSIDE DIRECTORS (the “Option Agreement”) is made and entered into as of , by and between Power Integrations, Inc. and (the “Optionee”).