0001193125-09-101676 Sample Contracts

POWER INTEGRATIONS, INC. EXECUTIVE OFFICER BENEFITS AGREEMENT
Executive Officer Benefits Agreement • May 6th, 2009 • Power Integrations Inc • Semiconductors & related devices • California

THIS EXECUTIVE OFFICER BENEFITS AGREEMENT (the “Agreement”) is made and entered into as of November 5, 2008 (the “Effective Date”), by and between POWER INTEGRATIONS, INC., a Delaware corporation, (the “Company”) and BILL ROESCHLEIN (“Executive”).

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AMENDMENT NUMBER ONE TO WAFER SUPPLY AGREEMENT
Wafer Supply Agreement • May 6th, 2009 • Power Integrations Inc • Semiconductors & related devices

This Amendment Number One (the “Amendment”), effective as of December 19, 2008 (the “Amendment Effective Date”), amends the Wafer Supply Agreement effective April 1, 2005 (the “Agreement”) by and between:

POWER INTEGRATIONS, INC. NONSTATUTORY STOCK OPTION AGREEMENT FOR OUTSIDE DIRECTORS
Nonstatutory Stock Option Agreement • May 6th, 2009 • Power Integrations Inc • Semiconductors & related devices • Delaware

THIS NONSTATUTORY STOCK OPTION AGREEMENT FOR OUTSIDE DIRECTORS (the “Option Agreement”) is made and entered into as of , by and between Power Integrations, Inc. and (the “Optionee”).

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