Agreement for Wafer Production and Testing Sample Contracts

AMENDMENT to the AGREEMENT FOR WAFER PRODUCTION AND TESTING Between Advanced Power Technology and Infineon Technologies Austria AG Siemensstr. 2, 9500 Villach, Austria

Agreement for Wafer Production and Testing • September 15th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices

• Contract Type
  Agreement for Wafer Production and Testing
• Filed
  September 15th, 2005
• Company
  Advanced Power Technology Inc
• Industry
  Semiconductors & related devices

WHEREAS, Advanced Power Technology (hereinafter “APT”) and Siemens Aktiengesellschaft (hereinafter “Siemens”) entered into the Agreement for Wafer Production and Testing on February 11,1998 (hereinafter “Basic Agreement”);

AMENDMENT to the

Agreement for Wafer Production and Testing • March 8th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices

• Contract Type
  Agreement for Wafer Production and Testing
• Filed
  March 8th, 2005
• Company
  Advanced Power Technology Inc
• Industry
  Semiconductors & related devices

WHEREAS, Advanced Power Technology (hereinafter “APT”) and Siemens Aktiengesellschaft (hereinafter “Siemens”) entered into the Agreement for Wafer Production and Testing on February 11, 1998 (hereinafter “Basic Agreement”);