FORM OF LIEN RELEASE AGREEMENTForm of Lien Release Agreement • March 24th, 2009 • Irvine Sensors Corp/De/ • Semiconductors & related devices • California
THIS LIEN RELEASE AGREEMENT (this “Agreement”) is made and entered into this 18th day of March, 2009 by and between Irvine Sensors Corporation, a Delaware corporation (the “Company”), and the undersigned investor (the “Investor”). Each of the Company and the Investor is sometimes referred to herein as a “Party,” and collectively as the “Parties.”
