EXHIBIT 10.43 GENERAL RELEASE, WAIVER AND COVENANT NOT TO SUE This GENERAL RELEASE, WAIVER AND COVENANT NOT TO SUE ("Agreement"), is made and entered into on this 29th day of February, 2004, ("Execution Date") by Jeffrey Michael Jenkins (SSN...General Release, Waiver and Covenant Not to Sue • May 7th, 2004 • Cabot Microelectronics Corp • Semiconductors & related devices • Illinois
Contract Type FiledMay 7th, 2004 Company Industry Jurisdiction
GENERAL RELEASE, WAIVER AND COVENANT NOT TO SUEGeneral Release, Waiver and Covenant Not to Sue • November 22nd, 2011 • Cabot Microelectronics Corp • Semiconductors & related devices • Illinois
Contract Type FiledNovember 22nd, 2011 Company Industry JurisdictionThis GENERAL RELEASE, WAIVER AND COVENANT NOT TO SUE (“Agreement”), is made and entered into as of the 1st day of July, 2011, (“Execution Date”) by Clifford L. Spiro (SSN ###-##-####), residing at 1216 Hollingswood Avenue, Naperville, Illinois 60564, hereinafter referred to as “you,” and Cabot Microelectronics Corporation, hereinafter referred to as “CMC”, on behalf of themselves, their heirs, successors and assigns.
GENERAL RELEASE, WAIVER AND COVENANT NOT TO SUEGeneral Release, Waiver and Covenant Not to Sue • February 3rd, 2022 • CMC Materials, Inc. • Semiconductors & related devices • Illinois
Contract Type FiledFebruary 3rd, 2022 Company Industry JurisdictionThis GENERAL RELEASE, WAIVER AND COVENANT NOT TO SUE (“Agreement”), is made and entered into this February 1, 2022 (“Execution Date”) by Scott D. Beamer, hereinafter referred to as “you,” and CMC Materials, Inc. hereinafter referred to as “CMC”, on behalf of themselves, their heirs, successors and assigns, pursuant to that certain letter of understanding entered into as of December 6, 2021 (“LOU”).