Shared Metallic Path Facility definition

Shared Metallic Path Facility or ‘SMPF’ means access to the non-voiceband frequencies of the

Shared Metallic Path Facility means access to the non-voiceband frequencies of the Metallic Path Facility.

Shared Metallic Path Facility or Shared MPF” a service permitting the use of a Shared Metallic Path Circuit between the Customer’s network termination point and an Internal Tie Cable or External Tie Cable to enable the Communications Provider to provide high bandwidth telecommunications service(s) to a Customer, providing that the circuit does not support an incompatible service as published from time to time by BT, whilst BT, or another electronic communication provider simultaneously provides telephony service to that same Customer;

Examples of Shared Metallic Path Facility in a sentence

• Sub-Loop Unbundling Shared Metallic Path Facility (SLU SMPF) provides access (via an access point) to the local network (usually the Openreach street cabinet) to enable SLU CPs to connect to their Fibre network, providing voice services over copper and broadband over fibre.

• The positioning of WBMC Shared and the products it consumes is illustrated in Figure 1 above.WBC ADSL & IPstream Connect are based on the Openreach Shared Metallic Path Facility (SMPF), DSLAM/MSANs located in BT Exchanges and BRASes in the IPsC/WBC Interconnect Nodes.

• Local Loop Unbundling Shared Metallic Path Facility (LLU SMPF) enables CPs to offer broadband services over an analogue line while another CP (or the same CP) supplies voice services on the same line – hence it being “shared”.

• SOTAP is being developed specifically to:  facilitate a smooth migration journey because in the majority of cases (where LLU Shared Metallic Path Facility (SMPF) already exists on the line) no physical engineering activities will be required as SOTAP is intended to reuse the LLU SMPF exchange equipment.

• A list of Steering Committee members is found at the beginning of this document.

• The Tie Pair Modification products let you change or modify the Metallic Path Facility (MPF) or Shared Metallic Path Facility (SMPF) tie-pair of an existing service.

• You can request Metallic Path Facility and Shared Metallic Path Facility products at premises designated as Hot Sites.

• Metallic Path Facility and Shared Metallic Path Facility products form part of a MPCn, which is the end-to-end metallic circuit between your customer’s Network Terminating Point and your Handover Distribution Frame.

• You can place an order for a new Metallic Path Facility or Shared Metallic Path Facility via the Equivalence Management Platform (EMP).

• You can request a daily report showing your service ID and the new Directory Number (DN) for DN changes associated with your Shared Metallic Path Facility circuits.