On Die Encapsulation. 1.1 Except as set out in Clause 1.2, if Licensee is distributing ARM Compliant Products Licensee shall apply the Trademark identified in Section 6 Part A of each Annex 1 to the die encapsulation (i.e. die package) of each unit of ARM Compliant Product.
Appears in 1 contract
Samples: Technology License Agreement (RDA Microelectronics, Inc.)
On Die Encapsulation. 1.1 Except as set out in Clause 1.2, if Licensee is distributing [ARM Compliant Products Products] Licensee shall apply the Trademark identified in Section 6 Part A of each Annex 1 this Schedule to the die encapsulation (i.e. die package) of each unit of [ARM Compliant Product].
Appears in 1 contract
On Die Encapsulation. 1.1 V.1 Except as set out in Clause 1.2, if Licensee is distributing ARM Compliant Products Licensee licensee shall apply the Trademark identified in Section 6 Part A of each Annex 1 I to the die encapsulation (i.e. die package) of each unit of ARM Compliant Product.
Appears in 1 contract
Samples: Technology License Agreement (GCT Semiconductor Inc)
On Die Encapsulation. 1.1 Except as set out in Clause 1.2, if Licensee is distributing ARM Compliant Products Licensee licensee shall apply the Trademark identified in Section 6 Part A of each Annex 1 I to the die encapsulation (i.e. die package) of each unit of ARM Compliant Product.
Appears in 1 contract
Samples: GCT Semiconductor Inc
