andIndenture • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
Contract Type FiledMarch 18th, 2005 Company Industry Jurisdiction
TRUST DEED RELATING TO ST ASSEMBLY TEST SERVICES LTD S$500,000,000 MULTICURRENCY MEDIUM TERM NOTE PROGRAMME [ALLEN & GLEDHILL LOGO] 36 ROBINSON ROAD #18-01 CITY HOUSE SINGAPORE 068877St Assembly Test Services LTD • February 28th, 2002 • Instruments for meas & testing of electricity & elec signals
Company FiledFebruary 28th, 2002 Industry
1 EXHIBIT 10.1 ST GROUP MANAGEMENT & SUPPORT SERVICES AGREEMENT THIS AGREEMENT is made the 27th day of December 1999 BETWEEN: (1) SINGAPORE TECHNOLOGIES PTE LTD, a company incorporated in Singapore and having its registered office at 51 Cuppage Road,...Services Agreement • January 3rd, 2000 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledJanuary 3rd, 2000 Company Industry
ANDSt Assembly Test Services LTD • March 19th, 2004 • Instruments for meas & testing of electricity & elec signals • New York
Company FiledMarch 19th, 2004 Industry Jurisdiction
ANDIndenture • March 31st, 2003 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • New York
Contract Type FiledMarch 31st, 2003 Company Industry Jurisdiction
RECITALSPledge Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledMarch 19th, 2004 Company Industry
BETWEENAgreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledMarch 19th, 2004 Company Industry
1 EXHIBIT 10.2 THIS AGREEMENT is made the 5th day of June One Thousand Nine Hundred and Ninety Eight (1998) Between: ST ASSEMBLY TEST SERVICES LTD a company incorporated in Singapore and having its registered office at 5 Yishun Street 23 Singapore...Agreement • January 3rd, 2000 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledJanuary 3rd, 2000 Company Industry
DATED AS OF NOVEMBER 18, 2004 BY AND AMONGRegistration Rights Agreement • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
Contract Type FiledMarch 18th, 2005 Company Industry Jurisdiction
1 EXHIBIT 1.1 ST Assembly Test Services Ltd 102,000,000 Ordinary Shares */ (S$0.25 par value) directly or in the form of American Depositary Shares Each American Depositary Share representing the right to receive ten Ordinary Shares U.S. Underwriting...St Assembly Test Services LTD • January 25th, 2000 • Instruments for meas & testing of electricity & elec signals • New York
Company FiledJanuary 25th, 2000 Industry Jurisdiction
Exhibit 4.41 ================================================================== ============== STATS CHIPPAC LTD. (a corporation organized under the laws of the Republic of Singapore) Senior Notes due 2011 PURCHASE AGREEMENT Dated: November 5, 2004...Purchase Agreement • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
Contract Type FiledMarch 18th, 2005 Company Industry Jurisdiction
1 EXHIBIT 2.2 DEPOSIT AGREEMENTDeposit Agreement • March 30th, 2001 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • New York
Contract Type FiledMarch 30th, 2001 Company Industry Jurisdiction
EXHIBIT 4.13 THIS SECURITY IS A GLOBAL NOTE WITHIN THE MEANING OF THE INDENTURE HEREINAFTER REFERRED TO AND IS REGISTERED IN THE NAME OF A DEPOSITARY OR A NOMINEE THEREOF, WHICH MAY BE TREATED BY THE COMPANY, THE TRUSTEE OR ANY AGENT THEREOF AS OWNER...St Assembly Test Services LTD • March 31st, 2003 • Instruments for meas & testing of electricity & elec signals
Company FiledMarch 31st, 2003 Industry
Exhibit 4.14 Date: January 8, 2004 To: ST Assembly Test Services Ltd From: Deutsche Bank AG, London Branch Our reference: 830928L Re: Asset Swap and Bond Sale Transaction Ladies and Gentlemen: The purpose of this letter agreement is to set forth the...St Assembly Test Services LTD • March 19th, 2004 • Instruments for meas & testing of electricity & elec signals
Company FiledMarch 19th, 2004 Industry
RECITALSExecution • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledMarch 19th, 2004 Company Industry
andIndenture • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
Contract Type FiledMarch 18th, 2005 Company Industry Jurisdiction
EXHIBIT 4.11 THIS SECURITY IS A GLOBAL NOTE WITHIN THE MEANING OF THE INDENTURE HEREINAFTER REFERRED TO AND IS REGISTERED IN THE NAME OF A DEPOSITARY OR A NOMINEE THEREOF, WHICH MAY BE TREATED BY THE COMPANY, THE TRUSTEE OR ANY AGENT THEREOF AS OWNER...St Assembly Test Services LTD • March 31st, 2003 • Instruments for meas & testing of electricity & elec signals
Company FiledMarch 31st, 2003 Industry
1 EXHIBIT 10.4 AN AGREEMENT made the 18th day of November 1996 BETWEEN HOUSING & DEVELOP- MENT BOARD, a Body Corporate incorporated under the Housing & Development Act and having its office at Bukit Merah Centre, 3451 Jalan Bukit Merah, Singapore...An Agreement • January 3rd, 2000 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledJanuary 3rd, 2000 Company Industry
Exhibit 4.4 STATS CHIPPAC LTD. SUBSTITUTE EQUITY INCENTIVE PLAN 1. Purposes of the Plan. Pursuant to that certain Agreement and Plan of Merger and Reorganization, dated as of February 10, 2004 (the "Merger Agreement"), among ST Assembly Test Services...St Assembly Test Services LTD • August 25th, 2004 • Instruments for meas & testing of electricity & elec signals
Company FiledAugust 25th, 2004 Industry
16 JANUARY 2004Securities Pledge Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • London
Contract Type FiledMarch 19th, 2004 Company Industry Jurisdiction
ARTICLE 2 NOTE GUARANTEESSubsidiary Guarantee Agreement • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
Contract Type FiledMarch 18th, 2005 Company Industry Jurisdiction
amongAgreement and Plan of Merger and Reorganization • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • Delaware
Contract Type FiledMarch 19th, 2004 Company Industry Jurisdiction
EXHIBIT 4.12 PAGES WHERE CONFIDENTIAL TREATMENT HAS BEEN REQUESTED ARE STAMPED 'CONFIDENTIAL TREATMENT REQUESTED AND THE REDACTED MATERIAL HAS BEEN SEPARATELY FILED WITH THE COMMISSION' AND THE CONFIDENTIAL SECTION HAS BEEN MARKED IN THE MARGIN WITH A...Immunity Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • Illinois
Contract Type FiledMarch 19th, 2004 Company Industry Jurisdiction
RELATING TO ST ASSEMBLY TEST SERVICES LTD S$500,000,000 MULTICURRENCY MEDIUM TERM NOTE PROGRAMME [ALLEN & GLEDHILL LOGO] 36, ROBINSON ROAD, #18-01, CITY HOUSE, SINGAPORE 068877. C O N T E N T SProgramme Agreement • February 28th, 2002 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledFebruary 28th, 2002 Company Industry
ARTICLE 2 NOTE GUARANTEESSupplemental Subsidiary Guarantee Agreement • February 28th, 2006 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
Contract Type FiledFebruary 28th, 2006 Company Industry Jurisdiction
GLOBAL NOTESt Assembly Test Services LTD • March 19th, 2004 • Instruments for meas & testing of electricity & elec signals
Company FiledMarch 19th, 2004 IndustryTHIS SECURITY IS A GLOBAL NOTE WITHIN THE MEANING OF THE INDENTURE HEREINAFTER REFERRED TO AND IS REGISTERED IN THE NAME OF THE BANK OF NEW YORK DEPOSITARY (NOMINEES) LIMITED AS NOMINEE FOR THE COMMON DEPOSITARY (THE "COMMON DEPOSITARY") FOR EUROCLEAR BANK S.A./N.V. ("EUROCLEAR") AND CLEARSTREAM BANKING, SOCIETE ANONYME ("CLEARSTREAM") OR A NOMINEE THEREOF, WHICH MAY BE TREATED BY THE COMPANY, THE TRUSTEE OR ANY AGENT THEREOF AS OWNER AND HOLDER OF THIS SECURITY FOR ALL PURPOSES. THIS GLOBAL NOTE MAY NOT BE EXCHANGED, IN WHOLE OR IN PART, FOR A SECURITY REGISTERED, AND NO TRANSFER OF THIS GLOBAL NOTE IN WHOLE OR IN PART MAY BE REGISTERED, IN THE NAME OF ANY PERSON OTHER THAN THE BANK OF NEW YORK DEPOSITORY (NOMINEES) LIMITED OR A NOMINEE THEREOF, EXCEPT IN THE LIMITED CIRCUMSTANCES SET FORTH IN THE INDENTURE.
EMPLOYMENT AGREEMENTEmployment Agreement • April 6th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledApril 6th, 2004 Company IndustryTHIS EMPLOYMENT AGREEMENT is dated as of this 26th day of February, 2004 by and among ST Assembly Test Services Ltd, a Singapore public company limited by shares (the “Company”), ChipPAC, Inc., a Delaware corporation (“ChipPAC”), Dennis Daniels, an individual (the “Employee”).
RELATING TO ST ASSEMBLY TEST SERVICES LTD S$500,000,000 MULTICURRENCY MEDIUM TERM NOTE PROGRAMME 36 ROBINSON ROAD #18-01 [ALLEN & GLEDHILL LOGO] CITY HOUSE SINGAPORE 068877 C O N T E N T SAgency Agreement • February 28th, 2002 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledFebruary 28th, 2002 Company Industry
MANAGEMENT AND UNDERWRITING AGREEMENT RELATING TO THE SINGAPORE RETAIL OFFERING ALLEN & GLEDHILL, 36, ROBINSON ROAD, #18-01, CITY HOUSE, SINGAPORE 068877.Management and Underwriting Agreement • January 25th, 2000 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledJanuary 25th, 2000 Company Industry
CHIPPAC, INC. RETENTION AND SEVERANCE AGREEMENTRetention and Severance Agreement • June 10th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledJune 10th, 2004 Company IndustryIn recognition of your committed efforts as an employee of ChipPAC, Inc. (the “Company”), we are offering you the opportunity to receive a special retention payment in the amount set forth below (the “Retention Payment”) and a special severance payment in the amount set forth below (the “Severance Payment,” together with other benefits, the “Severance Benefits”) in connection with the closing (the “Closing”) of the transactions contemplated by the Agreement and Plan of Merger and Reorganization among ST Assembly Test Services Ltd, Camelot Merger, Inc. and ChipPAC, Inc. dated as of February 10, 2004. The Retention Benefits and Severance Benefits both will be fully subject to the terms of the ChipPAC, Inc. Employee Retention and Severance Plan (the “Plan”). Capitalized terms used and not otherwise defined herein have the meanings set forth in the Plan.
SUPPLEMENTAL SUBSIDIARY GUARANTEE AGREEMENT with respect to the of STATS CHIPPAC LTD. Dated as of September 18, 2007 GUARANTORS STATS CHIPPAC, INC. STATS HOLDINGS LIMITED STATS CHIPPAC TEST SERVICES, INC. STATS CHIPPAC (BARBADOS) LTD. CHIPPAC...Supplemental Subsidiary Guarantee Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices • New York
Contract Type FiledMarch 7th, 2008 Company Industry JurisdictionSUPPLEMENTAL SUBSIDIARY GUARANTEE AGREEMENT dated as of September 18, 2007 (this “Supplemental Agreement”) made among STATS ChipPAC (Thailand) Limited, a Thailand corporation (the “New Guarantor”), each other then existing Guarantor under the Indenture and Original Agreements referred to below (each, a “Guarantor” and collectively, the “Guarantors” and which shall, upon due execution and delivery of this Supplemental Agreement, include the New Guarantor), STATS ChipPAC Ltd., a corporation organized under the laws of the Republic of Singapore, as issuer (the “Company”), and the Trustee (as defined below).
RECITALSYangdo Tambo Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
Contract Type FiledMarch 19th, 2004 Company Industry
Dated this 22nd day of June 2006 Between WUXI CR MICRO-ASSEMBLY TECH. LTD. as the manufacturer And CHINA RESOURCES LOGIC LIMITED And STATS CHIPPAC (BVI) LIMITED as the manufacturer’s representative And STATS CHIPPAC LTD. MANUFACTURER’S REPRESENTATIVE...Stats Chippac Ltd. • March 12th, 2007 • Semiconductors & related devices
Company FiledMarch 12th, 2007 Industry
ASSET PURCHASE AGREEMENT Dated as of July 25, 2007 Among STATS CHIPPAC (THAILAND) LIMITED. and STATS CHIPPAC LTD and LSI (THAI) LTD. And LSI CORPORATIONAsset Purchase Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices
Contract Type FiledMarch 7th, 2008 Company IndustryASSET PURCHASE AGREEMENT, dated as of July 25, 2007 (this “Agreement”) among, STATS CHIPPAC (THAILAND) LIMITED. a corporation organized under the laws of the Kingdom of Thailand (“Buyer”), STATS CHIPPAC LTD, a corporation organized under the laws of Singapore (“Buyer Guarantor”), LSI (THAI) LTD., a corporation organized under the laws of the Kingdom of Thailand (“Seller”) and LSI CORPORATION, a corporation organized under the laws of Delaware, USA (“Seller Guarantor”).
Dated this 21st day of May 2007 Between STATS ChipPAC Malaysia Sdn Bhd as vendor And Ningbo Mingxin Microelectronics Co. Ltd. as purchaser And Daheng New Epoch Technology, Inc. as guarantor for Ningbo Mingxin Microelectronics Co. Ltd. ASSETS SALE AND...Assets Sale and Purchase Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices
Contract Type FiledMarch 7th, 2008 Company Industry