Datang Telecom Technology & Industry Holdings Co., Ltd. Sample Contracts

SHARE PURCHASE AGREEMENT
Share Purchase Agreement • June 12th, 2015 • Datang Telecom Technology & Industry Holdings LTD • Semiconductors & related devices • Hong Kong

SHARE PURCHASE AGREEMENT (the “Agreement”), dated as of 11 June 2015, by and among Semiconductor Manufacturing International Corporation, a company established under the laws of Cayman Islands (the “Company”), and Datang Holdings (Hongkong) Investment Company Limited, a company established under the laws of Hong Kong (the “Buyer”).

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Dated 22 August 2014 and SUBSCRIPTION AGREEMENT relating to the exercise of pre-emptive right in connection with the issue of 2,590,000,000 Shares in the share capital of Semiconductor Manufacturing International Corporation
Subscription Agreement • August 27th, 2014 • Datang Telecom Technology & Industry Holdings LTD • Semiconductors & related devices • Hong Kong

Clause Page 1 DEFINITIONS AND INTERPRETATION 1 2 SUBSCRIPTION 4 3 CONDITIONS OF SUBSCRIPTION 4 4 COMPLETION OF THE SUBSCRIPTION 5 5 UNDERTAKINGS OF THE SUBSCRIBER AND THE COMPANY 5 6 REPRESENTATIONS, WARRANTIES AND UNDERTAKINGS 7 7 INDEMNITY 14 8 TERMINATION 15 9 ANNOUNCEMENT 16 10 TIME OF THE ESSENCE 17 11 NOTICES 17 12 MISCELLANEOUS 17 13 APPLICABLE LAW AND JURISDICTION 18

WARRANT AGREEMENT
Warrant Agreement • January 20th, 2012 • Datang Telecom Technology & Industry Holdings LTD • Semiconductors & related devices • Hong Kong

This WARRANT AGREEMENT, dated as of September 16, 2011 (the “Agreement”), is made by and between Datang Holdings (Hongkong) Investment Company Limited., a company incorporated in the Hong Kong Special Administrative Region of the People’s Republic of China ( “Hong Kong”) with Limited Liability with its registered address at 40/F, Bank of China Tower, 1 Garden Road, Central,, Hong Kong (the “Initial Holder”), and Semiconductor Manufacturing International Corporation, an exempted company incorporated under the laws of the Cayman Islands having a place of business located at No. 18 Zhang Jiang Road, Pudong New Area, Shanghai 201203, People’s Republic of China (the “Company”).

Dated December 18, 2013 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and DATANG HOLDINGS (HONGKONG) INVESTMENT COMPANY LIMITED
Subscription Agreement • December 20th, 2013 • Datang Telecom Technology & Industry Holdings LTD • Semiconductors & related devices
SHARE SUBSCRIPTION AGREEMENT
Share Subscription Agreement • January 20th, 2012 • Datang Telecom Technology & Industry Holdings LTD • Semiconductors & related devices • Hong Kong

SHARE SUBSCRIPTION AGREEMENT (the “Agreement” or this “Agreement”), dated as of 5 May, 2011, by and among Semiconductor Manufacturing International Corporation (the “Company”), and Datang Holdings (Hongkong) Investment Company Limited (the “Investor”).

Share Subscription Agreement
Share Subscription Agreement • June 6th, 2018 • Datang Telecom Technology & Industry Holdings Co., Ltd. • Semiconductors & related devices • Hong Kong

SHARE SUBSCRIPTION AGREEMENT (this “Agreement”) dated as of June 5, 2018, between DATANG HOLDINGS (HONGKONG) INVESTMENT COMPANY LIMITED, a company established and existing under the laws of the Hong Kong Special Administrative Region (“Hong Kong”) of the People’s Republic of China (“PRC” or “China”) (the “Company”), and LIGHTMANE HOLDINGS COMPANY LIMITED, a company established and existing under the laws of the British Virgin Islands (the “Subscriber”). The Company and the Subscriber are each referred to herein individually as a “Party” and collectively as the “Parties”.

Dated 22 August 2014
Supplemental Agreement • August 27th, 2014 • Datang Telecom Technology & Industry Holdings LTD • Semiconductors & related devices • Hong Kong

SUPPLEMENTAL to the Datang share purchase agreement (the “Datang Share Purchase Agreement”) dated 6 November 2008 between the Company and Datang.

Joint Filing Agreement
Joint Filing Agreement • January 20th, 2012 • Datang Telecom Technology & Industry Holdings LTD • Semiconductors & related devices

In accordance with Rule 13d-1(k) promulgated under the Securities Exchange Act of 1934, as amended, the undersigned hereby agree to the joint filing with all other Reporting Persons (as such term is defined in the Schedule 13D referred to below) on behalf of each of them of a statement on Schedule 13D (including amendments thereto) with respect to the common stock, par value US$0.0004 each, of Semiconductor Manufacturing International Corporation, a Cayman Islands company, and that this Agreement may be included as an exhibit to such joint filing. This Agreement may be executed in any number of counterparts, all of which taken together shall constitute one and the same instrument.

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