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Microelectronic Packaging Inc /Ca/ Sample Contracts

Standard Contracts

W I T N E S S E T H:
Settlement Agreement • August 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
WITNESSETH: ----------
Stock Option Agreement • February 25th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
EXHIBIT 10.93 AMENDED AND RESTATED -------------------- CONSULTING SERVICES AGREEMENT -----------------------------
Consulting Services Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
EXHIBIT "C"
Registration Rights Agreement • May 28th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
EXHIBIT 10.90 SECOND SECURED PROMISSORY NOTE ------------------------------
Secured Promissory Note • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices

WHEREAS, NSEB and MPI have mutually agreed to re-negotiate the terms and conditions of the aforementioned Agreement and Note;

WITNESSETH:
Stock Option Agreement • December 2nd, 1999 • Meltronix Inc • Semiconductors & related devices • California
EXHIBIT "A" SECOND AMENDMENT TO DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENT
Debt Conversion and Mutual Settlement and Release Agreement • September 3rd, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENT
Debt Conversion and Mutual Settlement and Release Agreement • August 16th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
AMENDMENT ---------
Restructuring, Settlement and Mutual Release Agreement • November 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENT
Debt Conversion and Mutual Settlement Agreement • August 16th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
EXHIBIT "E" ASSIGNMENT AGREEMENT
Assignment Agreement • May 28th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
ASSIGNMENT OF INTEREST UNDER LETTER AGREEMENT WITH STMICROELECTRONICS, INC.
Assignment of Interest • September 3rd, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices

THIS ASSIGNMENT OF INTEREST UNDER LETTER AGREEMENT WITH STMICROELECTRONICS, INC. ("Assignment"), is entered into effective as of April 21, 1999 ("Effective Date"), between FI Financial, LLC ("FIF"), and the party whose name appears below, which party is referred to herein as the "Assignee":

Agreement among Schlumberger Technologies, Inc. ATE Division,
Schlumberger/Microelectronic Packaging Agreement • March 31st, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
ADDENDUM TO STOCK OPTION AGREEMENT
Stock Option Agreement • February 25th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
WITNESSETH:
Offshore Securities Subscription Agreement • October 28th, 1996 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices