Standard Contracts
W I T N E S S E T H:Settlement Agreement • August 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Contract Type FiledAugust 13th, 1998 Company Industry Jurisdiction
SECOND AMENDMENT ---------------- This Second Amendment, dated as of September 9, 1997, is made and entered into between Microelectronic Packaging America (the "Borrower") and Citicorp USA, Inc. (the "Lender").Promissory Note • November 12th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • New York
Contract Type FiledNovember 12th, 1997 Company Industry Jurisdiction
WITNESSETH: ----------Stock Option Agreement • February 25th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Contract Type FiledFebruary 25th, 1998 Company Industry Jurisdiction
Exhibit 10.104 EMPLOYMENT AGREEMENT This Employment Agreement ("Agreement") is made and entered into effective as of the 6th day of October, 1997 ("Effective Date") by and between Microelectronic Packaging, Inc. a California corporation ("Company"),...Employment Agreement • November 12th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledNovember 12th, 1997 Company Industry
EXHIBIT 10.93 AMENDED AND RESTATED -------------------- CONSULTING SERVICES AGREEMENT -----------------------------Consulting Services Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Contract Type FiledApril 15th, 1997 Company Industry Jurisdiction
EXHIBIT "C"Registration Rights Agreement • May 28th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledMay 28th, 1999 Company Industry
EXHIBIT 10.98 LOAN AND SECURITY AGREEMENT --------------------------- This Loan and Security Agreement (this "Agreement"), effective 13 May, 1997 (the "Effective Date"), is by and between (a) Texas Instruments Singapore (Pte) Limited, a Singapore...Loan and Security Agreement • August 14th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Contract Type FiledAugust 14th, 1997 Company Industry Jurisdiction
EXHIBIT 10.89 AMENDED LOAN AND SECURITY AGREEMENT ----------------------------------- This Agreement ("Amended Agreement"), effective January 2, 1997, ("Effective Date") is by and between NS Electronics Bangkok (1993) Ltd. ("NSEB") and Microelectronic...Loan and Security Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledApril 15th, 1997 Company Industry
EXHIBIT 10.90 SECOND SECURED PROMISSORY NOTE ------------------------------Secured Promissory Note • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledApril 15th, 1997 Company IndustryWHEREAS, NSEB and MPI have mutually agreed to re-negotiate the terms and conditions of the aforementioned Agreement and Note;
EXHIBIT 99.7 MICROELECTRONIC PACKAGING, INC. STOCK ISSUANCE AGREEMENT ------------------------ AGREEMENT made this _____ day of ___________________ 19____, by and between Microelectronic Packaging, Inc., a California corporation, and , a Participant...Stock Issuance Agreement • February 25th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Contract Type FiledFebruary 25th, 1998 Company Industry Jurisdiction
WITNESSETH:Stock Option Agreement • December 2nd, 1999 • Meltronix Inc • Semiconductors & related devices • California
Contract Type FiledDecember 2nd, 1999 Company Industry Jurisdiction
EXHIBIT 10.85 ================== Novation Agreement Date: Parties: Microelectronic Packaging Inc. 9350 Trade Place San Diego, CA 92128 (hereinafter "MPI") Innoventure (S) Pte Ltd 133 New Bridge Road #17-08 Chinatown Point Singapore (hereinafter...Novation Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledApril 15th, 1997 Company Industry
FOURTH AMENDMENT ---------------- This Fourth Amendment, dated as of January 30, 1998, is made and entered into between Microelectronic Packaging America (the "Borrower") and Citicorp USA, Inc. (the "Lender").Promissory Note Amendment • March 31st, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • New York
Contract Type FiledMarch 31st, 1998 Company Industry Jurisdiction
EXHIBIT 10.91 ADDENDUM TWO ------------ AMENDED LOAN AND SECURITY AGREEMENT ----------------------------------- WHEREAS, TEXAS INSTRUMENTS SINGAPORE (PTE) LIMITED ("IT") and MICROELECTRONIC PACKAGING (S) PTE LTD ("MPS") have executed a Loan and...Loan and Security Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledApril 15th, 1997 Company Industry
EXHIBIT "A" SECOND AMENDMENT TO DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTDebt Conversion and Mutual Settlement and Release Agreement • September 3rd, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledSeptember 3rd, 1999 Company Industry
DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTDebt Conversion and Mutual Settlement and Release Agreement • August 16th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledAugust 16th, 1999 Company Industry
AMENDMENT ---------Restructuring, Settlement and Mutual Release Agreement • November 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledNovember 13th, 1998 Company Industry
EXHIBIT 10.72 VIA FAX AND EMAIL January 19, 1999 Mr. Thomas J. Gentry Vice President, Corporate Staff Manager, Treasury Services Texas Instruments Incorporated P.O. Box 650311 MS 3994 Dallas, TX 75265 RE: Conditional Agreement Reached on Conversion of...Conditional Agreement • April 15th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledApril 15th, 1999 Company Industry
EXHIBIT 99.6 MICROELECTRONIC PACKAGING, INC. NON-EMPLOYEE DIRECTOR AUTOMATIC STOCK OPTION AGREEMENT RECITALS -------- A. The Corporation has approved an automatic option grant program under the 1993 Stock Option/Stock Issuance Plan (the "Plan")...Non-Employee Director Automatic Stock Option Agreement • February 25th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Contract Type FiledFebruary 25th, 1998 Company Industry Jurisdiction
DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTDebt Conversion and Mutual Settlement Agreement • August 16th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledAugust 16th, 1999 Company Industry
EXHIBIT 10.84 RESTRUCTURING, SETTLEMENT AND MUTUAL RELEASE AGREEMENT ---------------------------- This Restructuring, Settlement and Mutual Release Agreement (this "Agreement") is entered into as of this 24th day of September, 1998 the "Effective...Settlement & Dispute Resolution • November 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Contract Type FiledNovember 13th, 1998 Company Industry Jurisdiction
EXHIBIT "E" ASSIGNMENT AGREEMENTAssignment Agreement • May 28th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledMay 28th, 1999 Company Industry
EXHIBIT 10.105 [LETTERHEAD OF MICROELECTRONIC PACKAGING, INC.] October 8, 1997 Vincent Woo Assistant General Manager ORIX Leasing Singapore Limited 331 North Bridge Road #19-01/06 Odeon Towers Singapore 188720 RE: HIRE PURCHASE AGREEMENTS:...Hire Purchase Agreement • November 12th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledNovember 12th, 1997 Company Industry
ASSIGNMENT OF INTEREST UNDER LETTER AGREEMENT WITH STMICROELECTRONICS, INC.Assignment of Interest • September 3rd, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledSeptember 3rd, 1999 Company IndustryTHIS ASSIGNMENT OF INTEREST UNDER LETTER AGREEMENT WITH STMICROELECTRONICS, INC. ("Assignment"), is entered into effective as of April 21, 1999 ("Effective Date"), between FI Financial, LLC ("FIF"), and the party whose name appears below, which party is referred to herein as the "Assignee":
AMENDMENT --------- FORBEARANCE, RESTRUCTURE AND MUTUAL RELEASE AGREEMENT This Amendment is entered into as of November 5, 1998 by and among Microelectronic Packaging, Inc. ("MPI"), CTM Electronics, Inc. ("CTM"), Microelectronic Packaging America...Forbearance, Restructure and Mutual Release Agreement • November 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledNovember 13th, 1998 Company Industry
Agreement among Schlumberger Technologies, Inc. ATE Division,Schlumberger/Microelectronic Packaging Agreement • March 31st, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Contract Type FiledMarch 31st, 1998 Company Industry Jurisdiction
This agreement is pursuant to an agreement between Microelectronic Packaging Inc and Innoventure (S) Pte Ltd dated 29 July 1993 (hereinafter "the Principal ------------ Agreement") and a Novation Agreement between the same parties dated and sets out...Subcontract Manufacturing Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledApril 15th, 1997 Company Industry
COMMON STOCK PURCHASE AGREEMENT This COMMON STOCK PURCHASE AGREEMENT (the "Agreement") is dated as of September ___, 2001, by and among Meltronix, Inc., a corporation organized under the laws of the State of California (the "Company") (OTCBB: "MTNX")...Common Stock Purchase Agreement • January 8th, 2002 • Meltronix Inc • Semiconductors & related devices • California
Contract Type FiledJanuary 8th, 2002 Company Industry Jurisdiction
THE SECURITIES REPRESENTED HEREBY HAVE NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933 (AS AMENDED), AND MAY NOT BE OFFERED, SOLD OR OTHERWISE TRANSFERRED, PLEDGED OR HYPOTHECATED IN THE ABSENCE OF A REGISTRATION STATEMENT IN EFFECT WITH RESPECT...Loan Agreement • January 8th, 2002 • Meltronix Inc • Semiconductors & related devices
Contract Type FiledJanuary 8th, 2002 Company Industry
ADDENDUM TO STOCK OPTION AGREEMENTStock Option Agreement • February 25th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledFebruary 25th, 1998 Company Industry
SECURED PROMISSORY NOTE $200,000.00 Date: April 6, 2001 FOR VALUE RECEIVED, Meltronix, Inc., a California corporation ("Meltronix"), promises to pay to La Jolla Cove Investors, Inc. ("LJCI"), the principal sum of Two Hundred Thousand Dollars...Secured Promissory Note • January 8th, 2002 • Meltronix Inc • Semiconductors & related devices
Contract Type FiledJanuary 8th, 2002 Company Industry
SECURITIES PURCHASE AGREEMENT Securities Purchase Agreement dated as of January 2, 2002 (this "Agreement") by and between Meltronix, Inc., a California corporation, with principal executive offices located at 9577 Chesapeake Drive, San Diego, CA 92123...Securities Purchase Agreement • January 8th, 2002 • Meltronix Inc • Semiconductors & related devices • California
Contract Type FiledJanuary 8th, 2002 Company Industry Jurisdiction
WITNESSETH:Offshore Securities Subscription Agreement • October 28th, 1996 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledOctober 28th, 1996 Company Industry
SECURED CONVERTIBLE PROMISSORY NOTE $250,000.00 Date: January 18, 2001 FOR VALUE RECEIVED, Meltronix, Inc., a California corporation ("Meltronix"), promises to pay to The Norman A. Lizt IRA ("Lizt"), the principal sum of Two Hundred Fifty Thousand...Secured Convertible Promissory Note • January 8th, 2002 • Meltronix Inc • Semiconductors & related devices
Contract Type FiledJanuary 8th, 2002 Company Industry
EXHIBIT 10.84 MICROELECTRONIC PACKAGING, INC. Amendment to Convertible Debentures ____ through ____ This Amendment to Convertible Debentures ____ through ____ (the "Original Debentures") is dated as of this 16th day of December, 1996, by and between...Convertible Debentures Amendment • January 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Contract Type FiledJanuary 15th, 1997 Company Industry Jurisdiction