Alternate Chemistry for Silicon Dioxide Chamber Clean Process Sample Clauses

Alternate Chemistry for Silicon Dioxide Chamber Clean Process. The IBM manufacturing process engineering staff has been independently evaluating alternative process configurations to achieve the reduction of global warming gas emissions through chemical substitution for the C2F6 gas. IBM has placed a continuous focus on achieving emissions reductions through improved utilization of materials within the manufacturing process or through the substitutions of materials with less environmental impact or improved utilization in the manufacturing process. The data in Attachment A details the results of IBM Burlington’s effort to reduce chemical usage and emissions and optimize its use and reduce the toxicity of the chemicals required to manufacture semiconductor modules. As discussed in Tier 1, IBM implemented process optimization work in 1996 which resulted in the 50% reduction in C2F6 usage and global warming gas emissions from these cleaning processes on specific sets of tools. Development and implementation of the substitute cleaning process was the next logical step in IBM’s effort to reduce global warming gas emissions from these cleaning processes. IBM has completed qualification of its alternate cleaning process and has begun implementing the process across its manufacturing operations, with the first installation conversions being done at the Burlington manufacturing facility. Implementation of the process across IBM is expected to take 2 to 4 years. IBM is working with the equipment manufacturers to make this process chemistry available for general use in the semiconductor industry to fulfill the requirements of the MOU. Table 3 shows the historical emission levels of global warming gases and the expected potential reduction in emissions levels that are projected as the new cleaning process is implemented at IBM Burlington over the next 18 months. Reductions of global warming gas emissions of greater than 98% percent can potentially be achieved in the chamber clean processes. This translates into a potential overall forty to sixty percent reduction in the total emissions of global warming gases from the Burlington Manufacturing facility once the process change has been fully implemented. This reduction is being achieved without the need to install any end-of-stack treatment or recycle systems. Table 3 GLOBAL WARMING GAS EMISSIONS 1995 Baseline Comparison All Values are Normalized for Production Index YE95 YE96 YE97 YE98 YE99 YE00
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