ADVANCED POWER TECHNOLOGY, INC. EMPLOYMENT AGREEMENT (MANAGEMENT & TECHNICAL PERSONNEL) EXEMPT SALARIED EMPLOYEES THIS EMPLOYMENT AGREEMENT is made and entered into this 9th day of August, 1985 by and between ADVANCED POWER TECHNOLOGY, INC., a...Employment Agreement • June 2nd, 2000 • Advance Power Technology Inc • Oregon
COMMON STOCKUnderwriting Agreement • August 4th, 2000 • Advanced Power Technology Inc • Semiconductors & related devices • Arkansas
SILICON VALLEY BANKLoan and Security Agreement • August 4th, 2000 • Advanced Power Technology Inc • Semiconductors & related devices • Oregon
MASTER AGREEMENT This Master Agreement ("Master Agreement") is entered into as of the 15th day of October, 1999 By and between Liaoning Huahai Power Electronics Co. Ltd., a Chinese corporation located at No. B Villa Area Xinghai Road JETDA, Jinzhou,...Master Agreement • August 4th, 2000 • Advanced Power Technology Inc • Semiconductors & related devices
Exhibit 1 JOINT FILING AGREEMENT In accordance with Rule 13d-1 (f) under the Securities Exchange Act of 1934, as amended, the undersigned hereby agree to the joint filing with all other Reporting Entities (as such term is defined in the Schedule 13G)...Joint Filing Agreement • January 10th, 2002 • Advanced Power Technology Inc • Semiconductors & related devices
CHANGE TO EMPLOYMENT AGREEMENT AMENDMENT DATED 3/5/86Employment Agreement • August 4th, 2000 • Advanced Power Technology Inc • Semiconductors & related devices • Oregon
ADVANCED POWER TECHNOLOGY, INC. EMPLOYMENT AGREEMENT (MANAGEMENT & TECHNICAL PERSONNEL) EXEMPT SALARIED EMPLOYEES THIS EMPLOYMENT AGREEMENT is made and entered into this day of AUGUST 16, 1985 by and between ADVANCED POWER TECHNOLOGY, INC., a Delaware...Employment Agreement • June 2nd, 2000 • Advance Power Technology Inc • Oregon
SUPPLY CONTRACTSupply Contract • August 4th, 2000 • Advanced Power Technology Inc • Semiconductors & related devices
MANUFACTURING AGREEMENT [*] = Material has been omitted pursuant to a request for confidential treatment, and such material has been filed separately with the SEC. This agreement is made as of ____________________, 1997 by and between SIEMENS AG, a...Manufacturing Agreement • August 4th, 2000 • Advanced Power Technology Inc • Semiconductors & related devices
SUPPLY CONTRACT Advanced Power Technology intends to secure silicon wafers for the manufacture of power switch devices. Wacker Siltronic Corporation manufactures silicon wafers and intends to supply this material. Set forth is the "Silicon Supply...Silicon Supply Agreement • June 2nd, 2000 • Advance Power Technology Inc
LOCK-UP AGREEMENTLock-Up Agreement • March 3rd, 2006 • Advanced Power Technology Inc • Semiconductors & related devices • Delaware
This Lock-Up Agreement (this “Agreement”) is made and entered into as of November 11, 2005, among Microsemi Corporation, a Delaware corporation (“Parent”), the undersigned stockholder and/or optionholder (“Holder”), and Advanced Power Technology, Inc., a Delaware corporation (the “Company”). Terms used herein and not defined herein shall have the meaning set forth in the Merger Agreement (as defined below).
SUBCONTRACT AGREEMENTSubcontract Agreement • August 4th, 2000 • Advanced Power Technology Inc • Semiconductors & related devices • California
[*] = Material has been omitted pursuant to a request for confidential treatment, and such material has been filed separately with the SEC.
DOCUMENT OF UNDERSTANDING BETWEEN ADVANCED ENERGY INDUSTRIES AND ADVANCED POWER TECHNOLOGY CONTRACT NUMBER: 1010 1. PREAMBLE This agreement is an extension of the original contract between Buyer and Seller entered into on August 14th, 1998. Amendments...Document of Understanding • August 4th, 2000 • Advanced Power Technology Inc • Semiconductors & related devices
RECITALSNorth America Distributor Agreement • August 4th, 2000 • Advanced Power Technology Inc • Semiconductors & related devices • Oregon
BETWEENWafer Production and Testing Agreement • August 4th, 2000 • Advanced Power Technology Inc • Semiconductors & related devices
AMENDMENT to the AGREEMENT FOR WAFER PRODUCTION AND TESTING Between Advanced Power Technology and Infineon Technologies Austria AG Siemensstr. 2, 9500 Villach, AustriaAgreement for Wafer Production and Testing • September 15th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices
WHEREAS, Advanced Power Technology (hereinafter “APT”) and Siemens Aktiengesellschaft (hereinafter “Siemens”) entered into the Agreement for Wafer Production and Testing on February 11,1998 (hereinafter “Basic Agreement”);
MANUFACTURING SERVICES AGREEMENT (hereafter MSA)Manufacturing Services Agreement • November 2nd, 2005 • Advanced Power Technology Inc • Semiconductors & related devices
This Agreement by and between Advanced Power Technology, and Semiconductor Assembler and Manufacturer, shall have an Effective Date of 11/1/05,
ADVANCED POWER TECHNOLOGY, INC. NORTH AMERICA DISTRIBUTOR AGREEMENTNorth America Distributor Agreement • March 8th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices • Oregon
This Agreement is made this 1st day of August 2002, by and between Advanced Power Technology, Inc., with its principal place of business at 405 S. W. Columbia Street, Bend, Oregon 97702, U.S.A. and Advanced Power Technology RF, Inc., with its principle place of business at 3350 Scott Blvd. Bldg 27, Santa Clara, CA U.S.A. and Advanced Power Technology RF, PA with its principle place of business at 140 Commerce Drive, Montgomeryville PA, U.S.A. (hereinafter and together referred to as “Company”), and Richardson Electronics. Ltd., a company organized and existing under the laws of Delaware with its principal place of business at 40W267 Keslinger Road. LaFox IL 60147 (Hereinafter referred to as “Distributor”).
LEASELease Agreement • March 8th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices • California
Landlord hereby leases to Tenant and Tenant hereby leases from Landlord the real property commonly known as APN #216-48-025 and Suite Number 100 (hereinafter called “Premises”) outlined on the floor plan attached hereto and marked Exhibit “A”, and said Premises being agreed, for the purpose of this Lease, to have an area of approximately
SUPPLY CONTRACTSupply Contract • January 6th, 2006 • Advanced Power Technology Inc • Semiconductors & related devices
Advanced Power Technology intends to secure silicon wafers for the manufacture of power switch devices. Siltronic Corporation manufactures silicon wafers and intends to supply this material. Set forth is the “Silicon Supply Agreement” between Advanced Power Technology (APT) located in Bend, OR and Siltronic Corporation (SCO) located in Portland, OR.
ASSET PURCHASE AGREEMENTAsset Purchase Agreement • June 17th, 2002 • Advanced Power Technology Inc • Semiconductors & related devices • California
ASSET PURCHASE AGREEMENT, dated as of May 7, 2002, by and between MICROSEMI RF PRODUCTS, INC., a Delaware corporation (the “Seller”), a wholly-owned subsidiary of Microsemi Corporation, a Delaware corporation (“Microsemi”) and RF ACQUISITION SUB, INC. (the “Purchaser”), a Delaware corporation and a wholly-owned subsidiary of Advanced Power Technology, Inc., a Delaware corporation (“APT”).
AGREEMENT AND PLAN OF MERGER AMONG ADVANCED POWER TECHNOLOGY, INC. POWERSICEL, INC. AND POWERSICEL ACQUISITION CORPORATIONMerger Agreement • December 23rd, 2004 • Advanced Power Technology Inc • Semiconductors & related devices • Oregon
THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of December [ ], 2004 (the “Agreement Date”) by and among Advanced Power Technology, Inc., a Delaware corporation (“Parent”), PowerSicel Acquisition Corporation, a Colorado corporation that is a wholly-owned subsidiary of Parent (“Sub”), PowerSicel, Inc., a Colorado corporation (“Company”), and Paul Jacobi, as representative of the shareholders of the Company (the “Representative”).
Manufacturing AgreementManufacturing Agreement • March 8th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices
WHEREAS, APT and Siemens Aktiengesellschaft (hereinafter “Siemens”) entered into a Manufacturing Agreement for the procurement of IGBT products including discrete packaged product and wafers on October 14, 1997 (hereinafter “Agreement”);
Amendment to Agreement and Plan of MergerAgreement and Plan of Merger • February 8th, 2002 • Advanced Power Technology Inc • Semiconductors & related devices
This Amendment to Agreement and Plan of Merger (the “Amendment”) is made as of January 10, 2002, among Advanced Power Technology, Inc., a Delaware corporation (“Parent”), GHz Acquisition, Inc., a Delaware corporation and wholly owned subsidiary of Parent (“Merger Sub”), and GHz Technology, Inc., a California corporation (the “Company”).
LOCK-UP AGREEMENTLock-Up Agreement • March 3rd, 2006 • Advanced Power Technology Inc • Semiconductors & related devices • Delaware
This Lock-Up Agreement (this “Agreement”) is made and entered into as of November 11, 2005, between Microsemi Corporation, a Delaware corporation (“Parent”), the undersigned stockholder and/or optionholder (“Holder”), and Advanced Power Technology, Inc., a Delaware corporation (the “Company”). Terms used herein and not defined herein shall have the meaning set forth in the Merger Agreement (as defined below).
ContractWarrant Agreement • February 8th, 2002 • Advanced Power Technology Inc • Semiconductors & related devices • Oregon
THIS WARRANT AND THE SHARES ISSUABLE HEREUNDER HAVE NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933, AS AMENDED, AND MAY NOT BE SOLD, PLEDGED, OR OTHERWISE TRANSFERRED WITHOUT AN EFFECTIVE REGISTRATION THEREOF UNDER SUCH ACT OR PURSUANT TO RULE 144 OR AN OPINION OF COUNSEL REASONABLY SATISFACTORY TO THE CORPORATION AND ITS COUNSEL THAT SUCH REGISTRATION IS NOT REQUIRED.
AGREEMENT AND PLAN OF MERGER BY AND AMONG MICROSEMI CORPORATION, APT ACQUISITION CORP. AND ADVANCED POWER TECHNOLOGY, INC.Merger Agreement • November 9th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices • Delaware
This AGREEMENT AND PLAN OF MERGER (this “Agreement”), dated November 2, 2005, is made and entered into by and among MICROSEMI CORPORATION, a Delaware corporation (“Parent”), APT ACQUISITION CORP., a Delaware corporation and wholly owned subsidiary of Parent (“Merger Sub”), and ADVANCED POWER TECHNOLOGY, INC., a Delaware corporation (the “Company”). Merger Sub and the Company are sometimes collectively referred to as the “Constituent Corporations.”
SUBCONTRACT AGREEMENT Between TEAM PACIFIC CORPORATION And ADVANCED POWER TECHNOLOGY January 27, 2003 To January 26, 2006Subcontract Agreement • March 8th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices • California
ADVANCED POWER TECHNOLOGY, INC., a corporation duly organized and existing under the laws of the United States of America, having its principal place of business at 405 S.W. Columbia Street, Bend, Oregon 97702, USA (hereinafter referred to as “Customer”) and
AGREEMENT FOR WAFER PRODUCTIONWafer Production Agreement • June 28th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices • Hong Kong
This Agreement (“Agreement”) is entered into on June 22, 2005 by Advanced Power Technology, Inc.; a Delaware Corporation with headquarters located at 405 SW Columbia Street in Bend, Oregon, USA (hereinafter referred to as “APT”)
Registration Rights Agreement ADVANCED POWER TECHNOLOGY, INC.Registration Rights Agreement • February 8th, 2002 • Advanced Power Technology Inc • Semiconductors & related devices • Delaware
This Registration Rights Agreement (the “Agreement”) is entered into as of the ____ day of _____________, 2001, by and among ADVANCED POWER TECHNOLOGY, Inc., a Delaware corporation (the “Company”), and the investors listed on Exhibit A hereto, referred to hereinafter as the “Investors” and each individually as an “Investor.”
Document of Understanding Between Advanced Energy Industries and Advanced Power Technologies Contract Number: 1010Document of Understanding • March 8th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices • Colorado
LOCKUP AGREEMENTLockup Agreement • March 21st, 2001 • Advanced Power Technology Inc • Semiconductors & related devices • Oregon
THIS LOCKUP AGREEMENT (this "Agreement"), made and entered into effective the 1st day of January, 2001, by and among RUSSELL J. CRECRAFT("RJC"), GREG M. HAUGEN ("GMH"), JOHN I. HESS ("JIH"), THOMAS A. LODER ("TAL"), and DAH WEN TSANG ("DWT") (together the "Withdrawing Members"), PATRICK P.H. SIRETA ("PPS") and SIRETA, L.L.C. ("Sireta") (together the "Remaining Members").
AGREEMENT AND PLAN OF MERGERMerger Agreement • February 8th, 2002 • Advanced Power Technology Inc • Semiconductors & related devices • Delaware
THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) dated as of December 6, 2001, among Advanced Power Technology, Inc., a Delaware corporation (“Parent”), GHz Acquisition, Inc., a Delaware corporation and a wholly owned Subsidiary of Parent (“Merger Sub”), and GHz Technology, Inc., a California corporation (the “Company”). Capitalized terms not otherwise defined in this Agreement shall have the meanings ascribed in Section 9.3.
SUPPLY CONTRACTSupply Contract • April 29th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices
Advanced Power Technology intends to secure silicon wafers for the manufacture of power switch devices. Siltronic Corporation manufactures silicon wafers and intends to supply this material. Set forth is the “Silicon Supply Agreement” between Advanced Power Technology (APT) located in Bend, OR and Siltronic Corporation (SCO) located in Portland, OR.
LEASE MODIFICATION PARTIES: LANDLORD: David E. Cookson TENANT: Advanced Power Technology, Inc. PROPERTY: 405 S.W. Columbia, Bend, Oregon 97702 The parties agree to modify that certain lease dated August 27, 1985 and modified September 15, 1995 as...Lease Modification • June 2nd, 2000 • Advance Power Technology Inc
