EXHIBIT 2.2 EXECUTION COPY STOCK PURCHASE AGREEMENTStock Purchase Agreement • September 3rd, 2004 • Amkor Technology Inc • Semiconductors & related devices
SHARE PURCHASE AGREEMENT THIS AGREEMENT dated the ------- day of --------- , 2004. BETWEEN: HU, FANG; And YU, BO (collectively, the "Vendors") AND: XIN NET CORP., a company duly incorporated under the laws of of Florida and having the business office...Share Purchase Agreement • February 17th, 2004 • Xin Net Corp • Services-computer processing & data preparation
SERVICE AGREEMENTService Agreement • June 30th, 2004 • Advanced Semiconductor Engineering Inc • Semiconductors & related devices
TERMINATION AGREEMENTTermination Agreement • February 17th, 2004 • Linktone LTD
AGREEMENTShareholder Agreement • April 14th, 2004 • Tengtu International Corp • Services-business services, nec
This Guaranty is executed as of JULY 16 , 1996.Guaranty • June 11th, 1997 • Panda Global Holdings Inc
DATED APRIL 26, 2000 BY AND AMONGStock Purchase Agreement • July 26th, 2000 • Luminent Inc
AMENDMENT TO ACQUISITION AGREEMENTAcquisition Agreement • April 9th, 2009 • China 3C Group • Blank checks
WITNESSETHEscrow Agreement • May 9th, 2000 • MRV Communications Inc • Semiconductors & related devices
Exhibit 10.38 SETTLEMENT AND GENERAL RELEASE AGREEMENT This Settlement and General Release Agreement (the "Agreement") is entered into as of November 14, 2003, Taipei time, by and among SanDisk Corporation, a company incorporated and existing under...Settlement Agreement • March 12th, 2004 • Sandisk Corp • Computer storage devices
EXHIBIT 10.5 LETTER AGREEMENT THIS LETTER AGREEMENT (the "AGREEMENT") is entered into on the 21st day of April, 2004 between Fengcheng Gold Corporation, Liaoning (an enterprise incorporated in [FORIEGN LANGUAGE CHARACTERS OMITTED] Liaoning province,...Letter Agreement • May 18th, 2004 • Ddi International Inc • Services-business services, nec
WITNESSETHShareholders' Agreement • May 20th, 1999 • Amkor Technology Inc • Semiconductors & related devices
Summary Translation)Supply Agreement • May 11th, 2007 • LDK Solar Co., Ltd.
ARTICLE 4 FOUNDATION OF THE JOINT VENTURES COMPANYJoint Venture Agreement • May 24th, 2004 • Enchanted Village Inc • Retail-hobby, toy & game shops
EXHIBIT E To the Credit AgreementManagement Services Agreement • November 19th, 2001 • Cbcom Inc • Services-business services, nec
FORM OFExecutive Employment Agreement • May 11th, 2007 • Yingli Green Energy Holding Co LTD
MANUFACTURING AGREEMENT THIS MANUFACTURING AGREEMENT ("Agreement") is made effective as of the 13 day of June 2000 ("Effective Date") by and between Shanghai Industrial Investment (Group), Co., Ltd. a corporation organized under the laws of the...Manufacturing Agreement • August 15th, 2000 • Myturn Com Inc • Services-computer integrated systems design
Exhibit 10.2 EMPLOYMENT AGREEMENT This Employment Agreement is entered into by and between Applied Films Corporation ("Company") of 9586 I-25 Frontage Road Longmont, CO 80504, USA and Dr. Chung Ping Lai ("Employee") who is a Taiwanese Citizen...Employment Agreement • May 11th, 2006 • Applied Films Corp • Semiconductors & related devices
Between Ko Ho Group And Arden Trading Company Ltd. And All the ShareholdersShare Purchase Agreement • July 2nd, 2007 • Oxford Investment Holdings Inc • Services-prepackaged software
Exhibit 2.1 STOCK PURCHASE AGREEMENT By and Among DII TAIWAN CORPORATION LTD., LITE-ON SEMICONDUCTOR CORPORATION, SHIN SHENG INVESTMENT LIMITED, SUN SHINING INVESTMENT CORP.Stock Purchase Agreement • December 21st, 2005 • Diodes Inc /Del/ • Semiconductors & related devices
ARTICLE II EFFECTIVE DATESale and Purchase Agreement • May 20th, 2003 • China Resources Development Inc • Wholesale-miscellaneous nondurable goods
Exhibit 10.52 ADDENDUM TO THE LICENSE AGREEMENT AND MUTUAL RELEASE Reference is made to the LICENSE AGREEMENT AND MUTUAL RELEASE (the "Agreement") made and entered into as of June 11, 2003, by and between ESS Technology International Inc. ("ETI"), ESS...License Agreement • November 14th, 2003 • Ess Technology Inc • Semiconductors & related devices
EXHIBIT 10.102 STEAM FOR PROCESS AND HEATING WATER SALES AGREEMENT THIS AGREEMENT, (the "Agreement") is made as of this 16th day of October, 1996, by and between Tangshan Cayman Heat and Power Company, Ltd., a Sino-foreign equity joint venture company...Sales Agreement • June 11th, 1997 • Panda Global Holdings Inc
CHINA MOBILE COMMUNICATIONS CORPORATION ANDSupplemental Agreement • June 26th, 2001 • China Mobile Hong Kong LTD /Adr/
EXECUTION VERSION NONCOMPETITION COVENANT AND AGREEMENT THIS NONCOMPETITION COVENANT AND AGREEMENT (this "AGREEMENT") is made and entered into as of this January 11, 2008, by Dr. ZHANG Zhengyu, an individual residing in the city of Beijing in the...Noncompetition Agreement • January 29th, 2008 • Abax Lotus Ltd. • Radio & tv broadcasting & communications equipment
Exhibit 16.1 AUTOMOTIVE REFINISH DISTRIBUTOR AGREEMENT (P.R.China)Distributor Agreement • December 15th, 2005 • Neomedia Technologies Inc • Services-computer integrated systems design
BETWEENOption Agreement • April 14th, 1997 • Sierra Semiconductor Corp • Semiconductors & related devices
Exhibit 10.2 ENGLISH TRANSLATION OF CHINESE LANGUAGE ORIGINAL Trademark License AgreementTrademark License Agreement • November 20th, 2003 • China Life Insurance Co LTD
OPTION AGREEMENTOption Agreement • March 24th, 1997 • Oak Technology Inc • Semiconductors & related devices
SONY BMGSale Agreement • June 30th, 2005 • Linktone LTD • Services-computer processing & data preparation
ContractContract • April 17th, 2002 • Cybersia Capital Corp
ContractTerms and Conditions • May 2nd, 2022
EXHIBIT 10.20 FINANCIAL ADVISORY AGREEMENT THIS FINANCIAL ADVISORY AGREEMENT ("Agreement") is made and entered into on this the _____ day of September, 2004, by and between HFG INTERNATIONAL, LIMITED, a Hong Kong corporation ("HFG"), and SHENZHEN BAK...Financial Advisory Agreement • June 22nd, 2005 • China Bak Battery Inc • Miscellaneous electrical machinery, equipment & supplies
ORACLE CLOUD SERVICES AGREEMENTOracle Cloud Services Agreement • March 5th, 2019
This Oracle Cloud Services Agreement (this “Agreement”) is between Oracle Taiwan LLC, Taiwan Branch (“Oracle”, “we,” “us,” or “our”) and (“You”). This Agreement sets forth the terms and conditions that govern orders placed under this Agreement.
Exhibit 10.1 AMENDMENT TO CONSULTING AGREEMENT Amendment (this "Amendment") made as of December 6, 2007 between Jade Art Group Inc. (the "Company") and Jin-Jun Xiong (the "Consultant"), an individual retained by the Company under that Consulting...Consulting Agreement • December 12th, 2007 • Jade Art Group Inc. • Services-management consulting services
