Probe Card Physical Characteristics Sample Clauses

Probe Card Physical Characteristics. Term Definition --------------------------- ------------------------------------------------------------ Braze Process of soldering probe tips to the springs using a * * * --------------------------- ------------------------------------------------------------ Die Coordinates Relative to The coordinate system specified by the PCB (S9K) designer should be oriented relative to the * * *. (Graphic available from ITO) If the viewing position is correct, there will be * * *. The origin of the die should be the * * *. --------------------------- ------------------------------------------------------------ ---------- *** Confidential treatment has been requested for portions of this exhibit. The copy filed herewith omits the information subject to the confidentiality request. Omissions are designated as *****. A complete version of this exhibit has been filed separately. -------------------- --------------------------------------------------- Discrete Components * * * -------------------- --------------------------------------------------- Hardware * * * -------------------- --------------------------------------------------- Interposer Temporary interconnect between the space transformer and the PCB. -------------------- --------------------------------------------------- PCB Signal Trace Electrical path on the printed circuit board from tester electrical contact point to the interposer connection point. -------------------- --------------------------------------------------- PCB Flatness Planar conformance of the probe card printed circuit board. * * * -------------------- -------------------------------------------------- PCB Thickness Nominal distance from the top to the bottom of the probe card printed circuit board. * * * -------------------- --------------------------------------------------- Probe Array Rotation The angle between the probe array X-Y axis and the (Graphic available probe card printed circuit board X-Y axis. * * * from ITO) -------------------- --------------------------------------------------- Probe Card Assembly The assembled probe card including printed circuit board, interposer, space transformer subassembly, and applicable mounting hardware. -------------------- --------------------------------------------------- Probe Depth * * * -------------------- -------------------------------------------------- Probe Spring Angle Specified in the above defined Die Coordinates Orientation Convention relative to PCB system (See Definition above) ...
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Related to Probe Card Physical Characteristics

  • Characteristics The Initial Contracts have the following characteristics: (i) all the Contracts are secured by Motorcycles; (ii) no Initial Contract has a remaining maturity of more than 84 months; and (iii) the final scheduled payment on the Initial Contract with the latest maturity is due not later than June 2014. Approximately 77.89% of the Principal Balance of the Initial Contracts as of the Initial Cutoff Date is attributable to loans for purchases of new Motorcycles and approximately 22.11% is attributable to loans for purchases of used Motorcycles. No Initial Contract was originated after the Initial Cutoff Date. No Initial Contract has a Contract Rate less than 3.989%. The last scheduled payment date of the Contracts (including any Subsequent Contracts) is due not later than September 2014. Approximately 98.98% of the Principal Balance of the Initial Contracts as of the Initial Cutoff Date is attributable to loans to purchase Motorcycles manufactured by Harley-Davidson or Buell and approximately 1.02% of the Principal Balance of the Initial Contracts as of the Initial Cutoff Date is attributable to loans to purchase Motorcycles not manufactured by Harley-Davidson or Buell.

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  • Individual Characteristics Each Receivable has the following individual characteristics as of the Cut-Off Date:

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  • Tooling Unless otherwise specified in this Agreement, all tooling and/or all other articles required for the performance hereof shall be furnished by Seller, maintained in good condition and replaced when necessary at Seller's expense. If NETAPP agrees to pay Seller for special tooling or other items either separately or as a stated part of the unit price of Goods purchased herein, title to same shall be and remain in NETAPP upon payment therefore.

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