TRANSPORT PACKING. The transport chain, the pack goods and the functional packing determine what forms of transport packing should be used. For consignments of undiced wafers which are being transported by heavy goods vehicle, (e.g. from Villach to Munich), wafer transport containers or transport boxes are used for transport packing. Products which need special security, e.g. wafers for smart cards, must only be transported in lockable wafer-transport containers. Batches of wafers should not be split. For consignments of chips (diced wafers) the form of packing used for transport comprises containers with polystyrene foam covers in transport boxes, or special boxes with foam in lays in transport boxes with rigid foam inserts. This type of packing is intended for external customers, contract manufacturers or HL sites. Transport boxes from blank wafer suppliers can be used if this saves time and reduces costs. The external companies' designations can if necessary be covered with neutral adhesive paper tape. The appropriate handling icons and transport markings for the goods should be affixed to the transport boxes. These should be printed as specified in DIN EN 20 780, Packaging; Pictorial marking for the handling of goods, and SN 66 769, Shipping marks for packages; Pictorial labels. When wafers are being air-freighted, the packages should be packed as 'loose cargo' batches or in LD3 airfreight containers. When doing so, care must be taken that any movement of the transport boxes is prevented by packing inserts.
TRANSPORT PACKING. The transport chain, the pack goods and the functional packing determine what form of transport packing is to be used.
