NAND Flash Memory Products definition

NAND Flash Memory Products has the meaning given in Section 3.2 of the Master Agreement.
NAND Flash Memory Products or “NAND,” as used herein, are NAND (both binary and MLC Flash Memory) Flash Memory Integrated Circuits (“ICs”), excluding any products with process design rules generally greater than ****. Embedded ICs incorporating NAND Flash Memory Products shall be considered to constitute “NAND Flash Memory Products” if the main function and value of such IC is flash memory, but shall not be considered to constitute “NAND Flash Memory Products” if the main function and value of such IC is logic. For the purpose of the foregoing, the “main function and value” of any product shall be considered to be flash memory if (x) the total NAND flash memory array area is greater than **** of the total die area or (y) the product is a cut-down or derivative of a standard NAND Flash Memory Product.
NAND Flash Memory Products has the meaning set forth in the JV Agreements.

Examples of NAND Flash Memory Products in a sentence

  • Where the Parties purchase the same output volume of equivalent Y4 NAND Flash Memory Products, the Parties will pay the same purchase price per unit.

  • If the new capacity secured at such external manufacturing source is requested by only one of the Parties, such Party will pay the transfer costs and be entitled to purchase the full output of NAND Flash Memory Products purchased by FVC Japan, Flash Partners or Flash Alliance, as applicable, from such external manufacturing source.

  • For purposes of this Section 6.13, “NAND Flash Memory Integrated Circuits” means ICs included in the definition of NAND Flash Memory Products pursuant to Section 3.2.

  • Flash Forward and Toshiba will enter into an exclusive lease agreement with respect to the Y5 Facility and Flash Forward’s manufacturing equipment located in the Y5 Facility to be used in the manufacture of Y5 NAND Flash Memory Products by Toshiba.

  • All references to JV Y5 NAND Flash Memory Products in the FFL Foundry Agreement are hereby revised to include JV X0 XxXX Products and, for Article 5 thereof, JV New Y2 BiCS Products manufactured for FFL.

  • Toshiba will manufacture Y4 NAND Flash Memory Products at the Y4 Facility for Flash Alliance ordered by Toshiba and SanDisk under the terms and conditions of the FA Purchase and Supply Agreements.

  • All references to Y4 NAND Flash Memory Products in the FAL Lease Agreement are hereby revised to include JV X0 XxXX Products and JV New Y2 BiCS Products manufactured for FAL.

  • The Parties acknowledge and agree that the purpose of the Master Operative Documents and Flash Forward is the manufacture, including by subcontract to Toshiba pursuant to the FF Foundry Agreement, and sale to Toshiba and SanDisk Flash of NAND Flash Memory Products manufactured at the facility known by the Parties as “Y5” (the “Y5 Facility” or “Y5”), which is a part of the Yokkaichi Facility, as well as to set forth each of SanDisk’s and Toshiba’s rights to Y5 Facility production.

  • The manufacture of BiCS Products for the JVs, in the New Y2 Facility or otherwise, shall be managed by the Parent Parties’ Management Representatives and the Operating Committees, in each case in accordance with the JV Agreements and past practice with respect to the manufacture of NAND Flash Memory Products.

  • EXHIBIT 10.1 FOIA Confidential Treatment Requested Execution Version with the equivalency being weighed based on the process complexity factors (as calculated by a formula to be mutually determined by the Parties) of the Y4 NAND Flash Memory Products.


More Definitions of NAND Flash Memory Products

NAND Flash Memory Products if the main function and value of such IC is logic. For the purpose of the foregoing, the “main function and value” of any product shall be considered to be flash memory if (x) the total NAND flash memory array area is greater than [***] of the total die area or (y) the product is a cut-down or derivative of a standard NAND Flash Memory Product.
NAND Flash Memory Products has the meaning given in Section 3.2 of the Master Agreement. “Net Book Value” means, with respect to any Person, the total assets of such Person less the total liabilities of such Person, in each case as determined in accordance with Japanese GAAP or US GAAP, as applicable. “Patent Indemnification Agreement” means the Patent Indemnification Agreement dated as of the Effective Date between Toshiba and SanDisk Corporation. * Indicates that certain information contained herein has been omitted and filed separately with the Securities and Exchange Commission. Confidential treatment has been requested with respect to the omitted portions.
NAND Flash Memory Products has the meaning given in Section 3.2(a)(iii) of the Master Agreement. “Y4 Facility” means the facility at which Y4 NAND Flash Memory Products are manufactured for Flash Alliance. “Y4 NAND Flash Memory Products” has the meaning given in Section 3.2(a)(iii) of the Master Agreement. “Y5 Facility” has the meaning given in the Master Agreement. “Y5 NAND Flash Memory Products” has the meaning given in Section 3.2(a)(ii) of the Master Agreement. “Yokkaichi Facility” means Toshiba’s facilities in Yokkaichi Japan, including the FVC Japan Equipment, the Y3 Facility, the Y4 Facility, the Y5 Facility and Toshiba’s Asahi facility. Rules of Construction and Documentary Conventions 2.1
NAND Flash Memory Products has the meaning set forth in the JV Agreements. “New Agreements” has the meaning set forth in the Recitals. “New Y2 BiCS Products” has the meaning set forth in Section 3.1(b). “New Y2 Capacity Ratio” for either SanDisk or Toshiba means ****. **** “New Y2 Facility” means the newly constructed production facility, owned by Toshiba and forming part of the Yokkaichi Facility, including a building shell, cleanroom, and all culverts, piping, ducting and associated infrastructure connecting thereto. “New Y2 Fixed Manufacturing Costs” means the New Y2 Manufacturing Costs described on Schedule 8.4(b)(i). “New Y2 JV Engineers” has the meaning set forth in Section 7.1(a). “New Y2 JV Headcount Plan” has the meaning set forth in Section 7.2. “New Y2 Manufacturing Costs” has the meaning set forth in Section 8.1. “New Y2 MCEIA” means that certain New Y2 Mutual Contribution and Environmental Indemnification Agreement, dated as of even date herewith, by and among Toshiba, SanDisk Cayman, SanDisk Ireland and SanDisk Flash. “New Y2 Operating Committee” has the meaning set forth in Section 6.1. Exhibit A-6

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