Planning and Forecasting. The Parties will regularly exchange information and co-ordinate the planning of the interconnected Networks so that services can be provided efficiently and operational problems avoided. The Parties shall prepare a Network Plan to guide the provision of Interconnection and other Services between the Parties. During the negotiations over this Agreement, both Operators’ engineers will meet and exchange their network plans. These plans will show the layout and capacity of the SIP Interconnect and IP transport, along with any proposed changes during the next 3 years. This information will be classified as confidential between the Operators. During these meetings the Operators will discuss and agree the initial requirements for interconnection.
Planning and Forecasting. (a) Micron shall furnish the Joint Venture Company with a forecast on a Fiscal Quarter basis, on a schedule agreed by the Parties, which includes the following information, collectively the (“Planning Forecast”): [***].
Planning and Forecasting. For planning and operational purposes, Nextel shall provide Motorola with a detailed twelve month (12-month) rolling forecast as follows:
Planning and Forecasting. (a) Intel will quarterly provide the Joint Venture Company, in a timeframe to be mutually agreed by the Parties to meet customer expectations, with a written demand forecast for [***] ([***]) quarters corresponding to the Joint Venture Company’s Fiscal Quarters or as may be otherwise agreed between the Parties. This demand will include desired finished product breakout by design id, technology node, wafer as finished goods or package type (“Demand Forecast”);
Planning and Forecasting. (a) During each Fiscal Month during the Term, Intel will provide the Joint Venture Company with a written demand forecast of its Probed Wafer needs for the current Fiscal Quarter plus the next **** Fiscal Quarters (the “Demand Forecast”). This demand will include desired Probed Wafer breakout by design id and Process Technology Node. In addition, the Demand Forecast will include the level of Probe Testing, marking specification, requested delivery date and place of delivery for the Probed Wafers, which information will be updated by Intel on a weekly basis as necessary.
Planning and Forecasting. (a) Starting upon the Effective Date and continuing on a Fiscal Quarter basis pursuant to a schedule agreed by the Parties, the Joint Venture Company will provide Micron a demand forecast setting forth the Joint Venture Company’s Probed Wafer demand. The forecast shall project Probed Wafer demand for the next [***] ([***]) Fiscal Quarters by design id, technology node and probe level (“Demand Forecast”).
Planning and Forecasting. (a) During each Fiscal Month during the Term, Micron will provide the Joint Venture Company with a written demand forecast of its Probed Wafer needs for the current Fiscal Quarter plus the next **** Fiscal Quarters (the “Demand Forecast”). This demand will include desired Probed Wafer breakout by design id and Process Technology Node. In addition, the Demand Forecast will include the level of Probe Testing, marking specification, requested delivery date and place of delivery for the Probed Wafers, which information will be updated by Micron on a weekly basis as necessary.
Planning and Forecasting. The Provider’s responsibilities include the following:
Planning and Forecasting. (a) At a point in each Fiscal Quarter as agreed by the Parties, each Purchaser shall provide the Joint Venture Company with a written non-binding forecast of such Purchaser’s demand (a “Demand Forecast”) for the next [***] Fiscal Quarters or as may be otherwise agreed by the Parties. All Demand Forecasts (i) shall include [***] and (ii) shall be [***].
Planning and Forecasting. (a) Intel Singapore will quarterly provide the Joint Venture Company, in a timeframe to be mutually agreed by the Parties to meet customer expectations, with a written demand forecast for [***] ([***]) quarters corresponding to the Joint Venture Company’s Fiscal Quarters or as may be otherwise agreed between the Parties. This demand will include desired finished product breakout by design id, technology node, wafer as finished goods or package type (“Demand Forecast”).
